Compaq 6000 Maintenance & Service Guide: HP Compaq 6000 and 6080 Pro Busin - Page 92

Speaker, support/files, Preparation for Disassembly, on Access Panel, Fan/Baffle Assembly

Page 92 highlights

5. If using a new heat sink, remove the protective covering from the bottom of the heat sink and place it in position atop the processor. 6. Secure the heat sink to the system board and system board tray with the four captive screws and attach the heat sink control cable to the system board. CAUTION: heat sink retaining screws should be tightened in diagonally opposite pairs (as in an X) to evenly seat the heat sink on the processor. This is especially important as the pins on the socket are very fragile and any damage to them may require replacing the system board. NOTE: After installing a new processor onto the system board, always update the system ROM to ensure that the latest version of the BIOS is being used on the computer. The latest system BIOS can be found on the Web at: http://h18000.www1.hp.com/support/files. Speaker 1. Prepare the computer for disassembly (Preparation for Disassembly on page 47). 2. Remove the access panel (Access Panel on page 48). 3. Remove the baffle (Fan/Baffle Assembly on page 77). 4. Disconnect the speaker wire from the system board (SPKR, P6). 5. From the inside of the chassis, remove the two silver T15 screws that secure the speaker to the chassis. 6. Slide the speaker up and lift it out of the chassis. To replace the speaker, reverse the removal procedures. When replacing the speaker, be sure to route the cable through the hole in the left side of the processor baffle. 82 Chapter 7 Removal and Replacement Procedures Microtower (MT) Chassis

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5.
If using a new heat sink, remove the protective covering from the bottom of the heat sink and
place it in position atop the processor.
6.
Secure the heat sink to the system board and system board tray with the four captive screws
and attach the heat sink control cable to the system board.
CAUTION:
heat sink retaining screws should be tightened in diagonally opposite pairs (as in
an X) to evenly seat the heat sink on the processor. This is especially important as the pins on
the socket are very fragile and any damage to them may require replacing the system board.
NOTE:
After installing a new processor onto the system board, always update the system ROM to
ensure that the latest version of the BIOS is being used on the computer. The latest system BIOS can
be found on the Web at:
support/files
.
Speaker
1.
Prepare the computer for disassembly (
Preparation for Disassembly
on page
47
).
2.
Remove the access panel (
Access Panel
on page
48
).
3.
Remove the baffle (
Fan/Baffle Assembly
on page
77
).
4.
Disconnect the speaker wire from the system board (SPKR, P6).
5.
From the inside of the chassis, remove the two silver T15 screws that secure the speaker to the
chassis.
6.
Slide the speaker up and lift it out of the chassis.
To replace the speaker, reverse the removal procedures.
When replacing the speaker, be sure to route the cable through the hole in the left side of the
processor baffle.
82
Chapter 7
Removal and Replacement Procedures Microtower (MT) Chassis