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Fujitsu MBA3147RC Product Manual - Page 50

VCM/SPM Driver, Read channel LSI

UPC - 102646074718

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Installation Requirements (5) Environmental temperature Temperature condition at installed in a cabinet is indicated with ambient temperature measured 30 mm from the HDD. At designing the system cabinet, consider following points. • Make a suitable air flow so that the DE surface temperature never exceed 60°C. • Cool the PCBA side especially with air circulation inside the cabinet. Confirm the cooling effect by measuring the surface temperature of specific ICs and the DE. These measurement results must satisfy the temperature condition listed in Table 4.1. • Keep the DE surface temperature at 50°C or below to meet the condition for assuring an MTBF of 1,400,000 hours. An air flow of 0.5 m/s or more is required at ambient temperature 30°C. Table 4.1 Surface temperature check point and maximum temperature No. Measurement point 1 DE Surface 2 Read channel LSI 3 VCM/SPM Driver 4 HDC 5 MPU Maximum temperature 60°C 82°C 100°C 97°C 94°C Figure 4.5 Surface temperature measurement points 46 C141-E252

Section	Page
Front Cover	1
FOR SAFE OPERATION	2
REVISION RECORD	3
Preface	5
Important Alert Items	7
MANUAL ORGANIZATION	9
CONTENTS	11
Illustrations	15
Figures	15
Tables	16
CHAPTER 1 General Description	17
1.1 Standard Features	17
1.2 Hardware Structure	21
1.3 System Configuration	22
CHAPTER 2 Specifications	23
2.1 Hardware Specifications	23
2.1.1 Model name and order number	23
2.1.2 Function specifications	24
2.1.3 Environmental specifications	27
2.1.4 Error rate	28
2.1.5 Reliability	28
CHAPTER 3 Data Format	31
3.1 Data Space	31
3.1.1 Cylinder configuration	31
3.1.2 Alternate spare area	34
3.1.3 Track format	35
3.1.4 Sector format	36
3.1.5 Format capacity	38
3.2 Logical Data Block Addressing	38
3.3 Defect Management	40
3.3.1 Defect list	40
3.3.2 Alternate block allocation	40
CHAPTER 4 Installation Requirements	45
4.1 Mounting Requirements	45
4.1.1 Dimensions	45
4.1.2 Mounting orientations	47
4.1.3 Notes on mounting	48
4.2 Power Supply Requirements	52
4.3 Connection Requirements	54
4.3.1 Connector location	54
4.3.2 Interface connector	55
4.3.3 Ready LED output signal	57
4.3.4 Connector requirements	57
CHAPTER 5 Installation	59
5.1 Notes on Handling HDDs	59
5.2 Setting	61
5.2.1 Port Address	61
5.3 Mounting HDDs	61
5.3.1 Mounting procedures	61
5.4 Checking Operation after Installation and Preparing the HDDs for Use	62
5.4.1 Checking initial operation	62
5.4.2 Formatting	63
5.4.3 Setting parameters	65
5.5 Dismounting HDDs	68
CHAPTER 6 Diagnostics and Maintenance	69
6.1 Diagnostics	69
6.1.1 Self-diagnostics	69
6.1.2 Test programs	72
6.2 Maintenance	73
6.2.1 Precautions	73
6.2.2 Maintenance requirements	74
6.2.3 Maintenance levels	75
6.2.4 Tools and test equipment	75
6.2.5 Tests	76
6.3 Operation Check	77
6.3.1 Initial seek operation check	77
6.3.2 Operation test	77
6.3.3 Diagnostic test	77
6.4 Troubleshooting	78
6.4.1 Outline of troubleshooting procedures	78
6.4.2 Troubleshooting with HDD replacement in the field	78
6.4.3 Troubleshooting at the repair site	80
6.4.4 Troubleshooting with parts replacement in the factory	81
6.4.5 Finding possibly faulty parts	81
6.5 Packaging	81
6.5.1 Unitary packaging	81
6.5.2 Multi-box packaging	82
CHAPTER 7 Error Analysis	85
7.1 Sense Data Collection	85
7.1.1 Sense data	85
7.1.2 Sense data format	85
7.2 Sense Data Analysis	87
7.2.1 Error information indicated with sense data	87
7.2.2 Sense data (3-0C-03), (4-32-01), (4-40-xx), (4-C4-xx), and (4-44-xx)	88
7.2.3 Sense data (1-1x-xx), (3-1x-xx) and (E-1D-00): Disk read error	88
7.2.4 Sense data (5-2x-xx), (B-47-xx), (B-4B-xx) and (B-4E-00): interface error	88
Glossary	89
Acronyms and Abbreviations	91
Index	93
Comment Form	97