HP 14-y000 14 Notebook PC Maintenance and Service Guide - Page 71

and the heat sink assembly spare part kits. Thermal paste is used on the processor

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3. Remove the heat sink assembly (2). NOTE: Due to the adhesive quality of the thermal material located between the heat sink assembly and system board components, it may be necessary to move the heat sink assembly from side to side to detach it. 4. Remove the thermal material. The thermal material must be thoroughly cleaned from the surfaces of the heat sink assembly and the system board components each time the heat sink assembly is removed. Replacement thermal material is included with the heat sink assembly and system board spare part kits. Thermal paste is used on the processor (1) and the heat sink assembly section (2) that services it. Reverse this procedure to install the heat sink assembly. Component replacement procedures 61

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3.
Remove the heat sink assembly
(2)
.
NOTE:
Due to the adhesive quality of the thermal material located between the heat sink assembly
and system board components, it may be necessary to move the heat sink assembly from side to side to
detach it.
4.
Remove the thermal material. The thermal material must be thoroughly cleaned from the surfaces of
the heat sink assembly and the system board components each time the heat sink assembly is
removed. Replacement thermal material is included with the heat sink assembly and system board
spare part kits. Thermal paste is used on the processor
(1)
and the heat sink assembly section
(2)
that
services it.
Reverse this procedure to install the heat sink assembly.
Component replacement procedures
61