HP ENVY 17-2090nr HP ENVY 17 (model numbers 2000 through 2099) - Maintenance a - Page 73

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4. Remove the fan/heat sink assembly (3). NOTE: The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink assembly and the system board each time the fan/heat sink assembly is removed: ● Thermal paste is used on the processor (1) and the heat sink section (2) that services it ● Thermal pads are used on the graphics subsystem chip (3) and the heat sink section (4) that services it ● Thermal pads are used on the system board capacitors (5) and the heat sink section (6) that services them Replacement thermal material is included with all fan/heat sink assembly, system board, and processor spare part kits. Reverse this procedure to install the fan/heat sink assembly. Component replacement procedures 65

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4.
Remove the fan/heat sink assembly
(3)
.
NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink
assembly and the system board each time the fan/heat sink assembly is removed:
Thermal paste is used on the processor
(1)
and the heat sink section
(2)
that services it
Thermal pads are used on the graphics subsystem chip
(3)
and the heat sink section
(4)
that
services it
Thermal pads are used on the system board capacitors
(5)
and the heat sink section
(6)
that
services them
Replacement thermal material is included with all fan/heat sink assembly, system board, and processor
spare part kits.
Reverse this procedure to install the fan/heat sink assembly.
Component replacement procedures
65