HP Pavilion Notebook - 14-v134ca HP Pavilion 14 Notebook PC HP Pavilion 14 Tou - Page 75

from side to side to detach it., assembly and system board components

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● Thermal paste is used on the processor (1) and the heat sink assembly section (2) that services it ● Thermal paste is used on the graphics subsystem chip (3) and the heat sink assembly section (4) that services it Reverse this procedure to install the heat sink assembly on computer models equipped with switchable discrete graphics. 5. Remove the four Phillips PM2.5x4.0 screws (1) that secure the heat sink assembly to the system board. 6. Remove the heat sink assembly (2). NOTE: Due to the adhesive quality of the thermal material located between the heat sink assembly and system board components, it may be necessary to move the heat sink assembly from side to side to detach it. 7. Remove the thermal material. The thermal material must be thoroughly cleaned from the surfaces of the heat sink assembly and the system board components each time the heat sink assembly is removed. Replacement thermal material is included with the heat sink assembly and system board spare part kits. Thermal paste is used on the processor (1) and the heat sink assembly section (2) that services it. Component replacement procedures 65

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●
Thermal paste is used on the processor
(1)
and the heat sink assembly section
(2)
that
services it
●
Thermal paste is used on the graphics subsystem chip
(3)
and the heat sink assembly
section
(4)
that services it
Reverse this procedure to install the heat sink assembly on computer models equipped with
switchable discrete graphics.
5.
Remove the four Phillips PM2.5x4.0 screws
(1)
that secure the heat sink assembly to
the system board.
6.
Remove the heat sink assembly
(2)
.
NOTE:
Due to the adhesive quality of the thermal material located between the heat sink
assembly and system board components, it may be necessary to move the heat sink assembly
from side to side to detach it.
7.
Remove the thermal material. The thermal material must be thoroughly cleaned from
the surfaces of the heat sink assembly and the system board components each time the heat
sink assembly is removed. Replacement thermal material is included with the heat sink
assembly and system board spare part kits. Thermal paste is used on the processor
(1)
and the heat sink assembly section
(2)
that services it.
Component replacement procedures
65