Intel 945G User Manual - Page 53

Intel® 945G Express Chipset Development Kit User's Manual Hardware References 4.5 Figure 15 Thermal Considerations The development kit is shipped with a heat sink/fan thermal solution for installation on the processor. This thermal solution has been tested in an open-air environment at room temperature and is sufficient for evaluation purposes. The designer must ensure that adequate thermal management is provided for any customer-derived designs. A chassis with a maximum internal ambient temperature of 38° C at the processor fan inlet is required. Use a processor heat sink that provides omni-directional airflow (similar to the type shown below) to maintain required airflow across the processor voltage regulator area. Processor Heat Sink for Omni-Directional Airflow Ensure that proper airflow is maintained in the processor voltage regulator circuit. Failure to do so may result in damage to the voltage regulator circuit. The processor voltage regulator area (item A in Figure 16) can reach a temperature of up to 85° C in an open chassis. Figure 16 shows the locations of the localized high temperature zones. To find out more on the processor heat sink installation guidelines, please visit the following website: http://www.intel.com/cd/channel/reseller/asmona/eng/products/box_processors/desktop/proc_dsk_p4/technical_reference/100617.htm Reference #308823 53