Intel D915GMH Product Specification - Page 13

Manufacturing Options

Page 13 highlights

Product Description Table 1. Feature Summary (continued) Expansion Capabilities • Two PCI Conventional bus add-in card connectors (SMBus routed to PCI Conventional bus connector 2) • One PCI Express x1 bus add-in card connector • One PCI Express x16 bus add-in card connector Hardware Monitor Subsystem • Hardware monitoring and fan control ASIC • Voltage sense to detect out of range power supply voltages • Thermal sense to detect out of range thermal values • Three fan connectors • Three fan sense inputs used to monitor fan activity • Fan speed control 1.3.2 Manufacturing Options Table 2 describes the manufacturing options on the Desktop Board D915GMH. Not every manufacturing option is available in all marketing channels. Please contact your Intel representative to determine which manufacturing options are available to you. Table 2. Manufacturing Options ATAPI CD-ROM Connector A connector for attaching an internal CD-ROM drive to the onboard audio subsystem Audio Subsystem Intel® High Definition Audio subsystem in one of the following configurations: • 8-channel (7.1) audio subsystem with five analog audio outputs using the Realtek ALC880 audio codec • 6-channel (5.1) audio subsystem with three analog audio outputs using the Realtek ALC860 audio codec IEEE-1394a Interface IEEE-1394a controller and two IEEE-1394a connectors (one back panel connector and one front-panel connector) LAN One of the following: • 10/100 Mbits/sec LAN subsystem using the Intel® 82562EZ Platform LAN Connect (PLC) device • Gigabit (10/100/1000 Mbits/sec) LAN subsystem using the Marvell* Yukon* 88E8050 PCI Express Gigabit Ethernet Controller RAID support RAID 0 and RAID 1 support with optional ICH6-R Security Trusted Platform Module (TPM): a component that enhances platform security S/PDIF Connector A 1 x 3 connector mounted on the component side of the board that provides digital audio signals in S/PDIF format For information about Available configurations for the Desktop Board D915GMH Refer to Section 1.4, page 17 13

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Product Description
13
Table 1.
Feature Summary
(continued)
Expansion
Capabilities
Two PCI Conventional bus add-in card connectors (SMBus routed to PCI
Conventional bus connector 2)
One PCI Express x1 bus add-in card connector
One PCI Express x16 bus add-in card connector
Hardware Monitor
Subsystem
Hardware monitoring and fan control ASIC
Voltage sense to detect out of range power supply voltages
Thermal sense to detect out of range thermal values
Three fan connectors
Three fan sense inputs used to monitor fan activity
Fan speed control
1.3.2
Manufacturing Options
Table 2 describes the manufacturing options on the Desktop Board D915GMH.
Not every
manufacturing option is available in all marketing channels.
Please contact your Intel
representative to determine which manufacturing options are available to you.
Table 2.
Manufacturing Options
ATAPI CD-ROM
Connector
A connector for attaching an internal CD-ROM drive to the onboard audio subsystem
Audio Subsystem
Intel
®
High Definition Audio subsystem in one of the following configurations:
8-channel (7.1) audio subsystem with five analog audio outputs using the
Realtek ALC880 audio codec
6-channel (5.1) audio subsystem with three analog audio outputs using the
Realtek ALC860 audio codec
IEEE-1394a
Interface
IEEE-1394a controller and two IEEE-1394a connectors (one back panel connector
and one front-panel connector)
LAN
One of the following:
10/100 Mbits/sec LAN subsystem using the Intel
®
82562EZ Platform LAN Connect
(PLC) device
Gigabit (10/100/1000 Mbits/sec) LAN subsystem using the Marvell* Yukon*
88E8050 PCI Express Gigabit Ethernet Controller
RAID support
RAID 0 and RAID 1 support with optional ICH6-R
Security
Trusted Platform Module (TPM):
a component that enhances platform security
S/PDIF Connector
A 1 x 3 connector mounted on the component side of the board that provides digital
audio signals in S/PDIF format
For information about
Refer to
Available configurations for the Desktop Board D915GMH
Section 1.4, page 17