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Thermal Considerations

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Technical Reference 2.11.4 Power Supply Considerations CAUTION The +5 V standby line for the power supply must be capable of providing adequate +5 V standby current. Failure to do so can damage the power supply. The total amount of standby current required depends on the wake devices supported and manufacturing options. System integrators should refer to the power usage values listed in Table 35 when selecting a power supply for use with the board. Additional power required will depend on configurations chosen by the integrator. 2.12 Thermal Considerations CAUTION A chassis with a maximum internal ambient temperature of 38 oC at the processor fan inlet is a requirement. Failure to provide this could result could result in damage to the board. CAUTION Failure to ensure appropriate airflow may result in reduced performance of both the processor and/or voltage regulator or, in some instances, damage to the board. All responsibility for determining the adequacy of any thermal or system design remains solely with the reader. Intel makes no warranties or representations that merely following the instructions presented in this document will result in a system with adequate thermal performance. CAUTION Ensure that the ambient temperature does not exceed the board's maximum operating temperature. Failure to do so could cause components to exceed their maximum case temperature and malfunction. For information about the maximum operating temperature, see the environmental specifications in Section 2.14. CAUTION Ensure that proper airflow is maintained in the processor voltage regulator circuit. Failure to do so may result in damage to the voltage regulator circuit. Figure 28 shows the locations of the localized high temperature zones. 77

Section	Page
Intel® Desktop Board D915GMH Technical Product Specification	1
Revision History	2
Preface	3
Intended Audience	3
What This Document Contains	3
Typographical Conventions	3
Other Common Notation	4
Contents	5
1 Product Description	11
1.1 PCI Bus Terminology Change	11
1.2 Power Connector Terminology Change	11
1.3 Overview	12
1.3.1 Feature Summary	12
1.3.2 Manufacturing Options	13
1.3.3 Board Layout	14
1.3.4 Block Diagram	16
1.4 Online Support	17
1.5 Processor	17
1.6 System Memory	18
1.6.1 Memory Configurations	20
1.7 Intel® 915G Chipset	24
1.7.1 Intel 915G Graphics Subsystem	24
1.7.2 USB	26
1.7.3 IDE Support	26
1.7.4 Real-Time Clock, CMOS SRAM, and Battery	28
1.8 PCI Express Connectors	28
1.9 I/O Controller	29
1.9.1 Serial Port	29
1.9.2 Parallel Port	29
1.9.3 Diskette Drive Controller	29
1.9.4 Keyboard and Mouse Interface	30
1.10 Audio Subsystem	30
1.10.1 Audio Subsystem Software	31
1.10.2 Audio Connectors	31
1.10.3 8-Channel (7.1) Audio Subsystem	32
1.10.4 6-Channel (5.1) Audio Subsystem	34
1.11 LAN Subsystem	35
1.11.1 10/100 Mbits/sec LAN Subsystem	35
1.11.2 Gigabit LAN Subsystem	36
1.11.3 Alert Standard Format (ASF) Support	37
1.11.4 LAN Subsystem Software	38
1.12 Hardware Management Subsystem	38
1.12.1 Hardware Monitoring and Fan Control ASIC	38
1.12.2 Thermal Monitoring	39
1.12.3 Fan Monitoring	40
1.12.4 Chassis Intrusion and Detection	40
1.13 Power Management	40
1.13.1 ACPI	40
1.13.2 Hardware Support	42
1.14 Trusted Platform Module (Optional)	46
1.14.1 System Requirements	46
1.14.2 Warning of Potential Data Loss	46
1.14.3 Security Precautions	47
1.14.4 Trusted Platform Module Ownership	48
1.14.5 Enabling the Trusted Platform Module	49
1.14.6 Assuming Trusted Platform Module Ownership	49
1.14.7 Recovery Procedures	50
1.14.8 Clearing Trusted Platform Module Ownership	51
1.14.9 Software Support	52
2 Technical Reference	53
2.1 Introduction	53
2.2 Memory Resources	53
2.2.1 Addressable Memory	53
2.2.2 Memory Map	55
2.3 DMA Channels	55
2.4 Fixed I/O Map	56
2.5 PCI Configuration Space Map	57
2.6 Interrupts	58
2.7 PCI Conventional Interrupt Routing Map	59
2.8 Connectors	60
2.8.1 Back Panel Connectors	60
2.8.2 Component-side Connectors	64
2.9 Jumper Block	72
2.10 Mechanical Considerations	73
2.10.1 Form Factor	73
2.10.2 I/O Shield	74
2.11 Electrical Considerations	76
2.11.1 DC Loading	76
2.11.2 Add-in Board Considerations	76
2.11.3 Fan Connector Current Capability	76
2.11.4 Power Supply Considerations	77
2.12 Thermal Considerations	77
2.13 Reliability	79
2.14 Environmental	80
2.15 Regulatory Compliance	81
2.15.1 Safety Regulations	81
2.15.2 EMC Regulations	81
2.15.3 European Union Declaration of Conformity Statement	82
2.15.4 Product Ecology Statements	83
2.15.5 Product Certification Markings (Board Level)	84
3 Overview of BIOS Features	85
3.1 Introduction	85
3.2 BIOS Flash Memory Organization	86
3.3 Resource Configuration	86
3.3.1 PCI Autoconfiguration	86
3.3.2 PCI IDE Support	86
3.4 System Management BIOS (SMBIOS)	87
3.5 Legacy USB Support	87
3.6 BIOS Updates	88
3.6.1 Language Support	88
3.6.2 Custom Splash Screen	88
3.7 Boot Options	89
3.7.1 CD-ROM Boot	89
3.7.2 Network Boot	89
3.7.3 Booting Without Attached Devices	89
3.7.4 Changing the Default Boot Device During POST	89
3.8 Fast Booting Systems with Intel® Rapid BIOS Boot	90
3.8.1 Peripheral Selection and Configuration	90
3.8.2 Intel® Rapid BIOS Boot Raid BIOS Boot	90
3.9 BIOS Security Features	91
4 Error Messages and Beep Codes	93
4.1 BIOS Error Messages	93
4.2 Port 80h POST Codes	95
4.3 Bus Initialization Checkpoints	99
4.4 Speaker	100

Match case Limit results 1 per page

Technical Reference

2.11.4

Power Supply Considerations

CAUTION

The +5 V standby line for the power supply must be capable of providing adequate +5 V standby

current.

Failure to do so can damage the power supply.

The total amount of standby current

required depends on the wake devices supported and manufacturing options.

System integrators should refer to the power usage values listed in Table 35 when selecting a power

supply for use with the board.

Additional power required will depend on configurations chosen by

the integrator.

2.12

Thermal Considerations

CAUTION

A chassis with a maximum internal ambient temperature of 38

C at the processor fan inlet is a

requirement.

Failure to provide this could result could result in damage to the board.

CAUTION

Failure to ensure appropriate airflow may result in reduced performance of both the processor

and/or voltage regulator or, in some instances, damage to the board.

All responsibility for determining the adequacy of any thermal or system design remains solely with

the reader.

Intel makes no warranties or representations that merely following the instructions

presented in this document will result in a system with adequate thermal performance.

CAUTION

Ensure that the ambient temperature does not exceed the board’s maximum operating temperature.

Failure to do so could cause components to exceed their maximum case temperature and

malfunction.

For information about the maximum operating temperature, see the environmental

specifications in Section 2.14.

CAUTION

Ensure that proper airflow is maintained in the processor voltage regulator circuit.

Failure to do

so may result in damage to the voltage regulator circuit.

Figure 28 shows the locations of the localized high temperature zones.