Intel DN2820FYK Technical Product Specification - Page 11

Product Description

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1 Product Description 1.1 Overview 1.1.1 Feature Summary Table 1 summarizes the major features of the board. Table 1. Feature Summary Form Factor Processor Memory Graphics Audio Peripheral Interfaces Expansion Capabilities BIOS 4.0 inches by 4.0 inches (101.60 millimeters by 101.60 millimeters) • Soldered-down Intel® Celeron® processor N2820 with up to 7.5 W TDP ― Integrated graphics ― Integrated memory controller ― Integrated PCH • Support for DDR3L 1066 MHz SO-DIMM • Support for 1 Gb, 2 Gb, and 4 Gb memory technology • Support for up to 8 GB of system memory with one SO-DIMM using 4 Gb memory technology • Support for non-ECC memory • Support for 1.35 V low voltage JEDEC memory • Integrated graphics support with Intel® Graphics Technology • One High Definition Multimedia Interface* (HDMI*) back panel connector • Intel® High Definition Audio via the HDMI v1.4a interfaces • Intel HD Audio via a stereo microphone/headphone jack on the back panel • Back panel audio jack (3.5 mm jack) • USB ports: ― Two USB 2.0 back panel connectors ― One USB 3.0 front panel connector ― One port is reserved for the PCI Express* Half-Mini Card • SATA ports: ― One SATA 3.0 Gb/s port • Consumer Infrared (CIR) • One PCI Express Half-Mini Card connector • Intel® BIOS resident in the Serial Peripheral Interface (SPI) Flash device • Support for Advanced Configuration and Power Interface (ACPI), Plug and Play, and System Management BIOS (SMBIOS) continued 11

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11
1
Product Description
1.1
Overview
1.1.1
Feature Summary
Table 1 summarizes the major features of the board.
Table 1.
Feature Summary
Form Factor
4.0 inches by 4.0 inches (101.60 millimeters by 101.60 millimeters)
Processor
•
Soldered-down Intel
®
Celeron
®
processor N2820 with up to 7.5 W TDP
―
Integrated graphics
―
Integrated memory controller
―
Integrated PCH
Memory
•
Support for DDR3L 1066 MHz SO-DIMM
•
Support for 1 Gb, 2 Gb, and 4 Gb memory technology
•
Support for up to 8 GB of system memory with one SO-DIMM using 4 Gb
memory technology
•
Support for non-ECC memory
•
Support for 1.35 V low voltage JEDEC memory
Graphics
•
Integrated graphics support with Intel
®
Graphics Technology
•
One High Definition Multimedia Interface* (HDMI*) back panel connector
Audio
•
Intel
®
High Definition Audio via the HDMI v1.4a interfaces
•
Intel HD Audio via a stereo microphone/headphone jack on the back panel
•
Back panel audio jack (3.5 mm jack)
Peripheral
Interfaces
•
USB ports:
―
Two USB 2.0 back panel connectors
―
One USB 3.0 front panel connector
―
One port is reserved for the PCI Express* Half-Mini Card
•
SATA ports:
―
One SATA 3.0 Gb/s port
•
Consumer Infrared (CIR)
Expansion
Capabilities
•
One PCI Express Half-Mini Card connector
BIOS
•
Intel
®
BIOS resident in the Serial Peripheral Interface (SPI) Flash device
•
Support for Advanced Configuration and Power Interface (ACPI), Plug and
Play, and System Management BIOS (SMBIOS)
continued