Intel DN2820FYK Technical Product Specification - Page 46

Intel NUC Board DN2820FY Technical Product Specification

46

2.7

Reliability

The Mean Time Between Failures (MTBF) prediction is calculated using component and

subassembly random failure rates.

The calculation is based on the Telcordia SR-332-2

Issue 2, Method I, Case 3, 55 ºC ambient.

The MTBF prediction is used to estimate

repair rates and spare parts requirements.

The MTBF for the board is 65,955 hours.

2.8

Environmental

Table 15 lists the environmental specifications for the board.

Table 15.

Environmental Specifications

NOTE

Before attempting to operate this board, the overall temperature of the board must be

above the minimum operating temperature specified. It is recommended that the

board temperature be at least room temperature before attempting to power on the

board. The operating and non-operating environment must avoid condensing humidity.

Parameter

Specification

Temperature

Non-Operating

-40

°

C to +60

°

C

Operating

0

°

C to +50

°

C

Shock

Unpackaged

50 g trapezoidal waveform

Velocity change of 170 inches/s²

Packaged

Half sine 2 millisecond

Product Weight (pounds)

Free Fall (inches)

Velocity Change (inches/s²)

<20

36

167

21-40

30

152

41-80

24

136

81-100

18

118

Vibration

Unpackaged

5 Hz to 20 Hz:

0.01 g² Hz sloping up to 0.02 g² Hz

20 Hz to 500 Hz:

0.02 g² Hz (flat)

Packaged

5 Hz to 40 Hz:

0.015 g² Hz (flat)

40 Hz to 500 Hz:

0.015 g² Hz sloping down to 0.00015 g² Hz

Section	Page
Intel® NUC Board DN2820FY Technical Product Specification	1
Revision History	2
Board Identification Information	3
Errata	3
Preface	5
Contents	7
1 Product Description	11
1.1 Overview	11
1.1.1 Feature Summary	11
1.1.2 Board Layout (Top)	13
1.1.3 Board Layout (Bottom)	15
1.1.4 Block Diagram	17
1.2 Online Support	18
1.3 Processor	18
1.4 System Memory	19
1.5.2 USB	21
1.6 SATA Interface	22
1.6.1 AHCI Mode	22
1.7 Real-Time Clock Subsystem	22
1.8 LAN Subsystem	23
1.8.1 Realtek* 8111GN-CG Gigabit Ethernet Controller	24
1.8.2 LAN Subsystem Software	24
1.8.3 RJ-45 LAN Connector with Integrated LEDs	25
1.9 Hardware Management Subsystem	26
1.9.1 Hardware Monitoring	26
1.9.2 Fan Monitoring	26
1.9.3 Thermal Solution	27
1.10 Power Management	28
1.10.1 ACPI	28
1.10.2 Hardware Support	30
2 Technical Reference	33
2.1 Memory Resources	33
2.1.1 Addressable Memory	33
2.2 Connectors and Headers	33
2.2.1 Front Panel Connector	34
2.2.2 Back Panel Connectors	35
2.2.3 Connectors and Headers (Bottom)	36
2.3 BIOS Security Jumper	40
2.4 Mechanical Considerations	42
2.4.1 Form Factor	42
2.5 Electrical Considerations	43
2.5.1 Power Supply Considerations	43
2.5.2 Fan Header Current Capability	43
2.6 Thermal Considerations	43
2.7 Reliability	46
2.8 Environmental	46
3 Overview of BIOS Features	47
3.1 Introduction	47
3.2 BIOS Flash Memory Organization	47
3.3 System Management BIOS (SMBIOS)	47
3.4 Legacy USB Support	48
3.5 BIOS Updates	48
3.5.1 Language Support	49
3.5.2 Custom Splash Screen	49
3.6 BIOS Recovery	50
3.7 Boot Options	51
3.7.1 Network Boot	51
3.7.2 Booting Without Attached Devices	51
3.7.3 Changing the Default Boot Device During POST	51
3.8 Hard Disk Drive Password Security Feature	53
3.9 BIOS Security Features	54
4 Error Messages and Blink Codes	55
4.1 Front-panel Power LED Blink Codes	55
4.2 BIOS Error Messages	55
5 Regulatory Compliance and Battery Disposal Information	57
5.1 Regulatory Compliance	57
5.1.1 Safety Standards	57
5.1.2 European Union Declaration of Conformity Statement	58
5.1.3 Product Ecology Statements	59
5.1.4 EMC Regulations	59
5.1.5 e-Standby and ErP Compliance	62
5.1.6 Regulatory Compliance Marks (Board Level)	63

Intel DN2820FYK Technical Product Specification - Page 46

Reliability, Environmental

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