Intel DQ965WC Product Specification - Page 68
Reliability
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Intel Desktop Board DQ965WC Technical Product Specification Table 33 provides maximum case temperatures for the board components that are sensitive to thermal changes. The operating temperature, current load, or operating frequency could affect case temperatures. Maximum case temperatures are important when considering proper airflow to cool the board. Table 33. Thermal Considerations for Components Component Maximum Case Temperature Processor Intel 82Q965 GMCH Intel 82801HO ICH8DO For processor case temperature, see processor datasheets and processor specification updates 97 oC (under bias) 105 oC (under bias) For information about Processor datasheets and specification updates Refer to Section 1.2, page 15 2.12 Reliability The Mean Time Between Failures (MTBF) prediction is calculated using component and subassembly random failure rates. The calculation is based on the Bellcore Reliability Prediction Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF prediction is used to estimate repair rates and spare parts requirements. The MTBF data is calculated from predicted data at 55 ºC. The Desktop Board DQ965WC MTBF is 66,173 hours. 68