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Intel QX9770 Design Guidelines - Page 10

Document Scope, Advanced Liquid Cooling Technology for the processor. - steppings

UPC - 735858197564

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LGA775 Socket Heatsink Loading 1.1.3 Document Scope This design guide supports the following processor: • Intel® Core™2 Extreme processor QX6800 B3 Stepping • Intel® Core™2 Extreme processor QX9770 C0 Stepping In this document when a reference is made to "the processor" it is intended that this includes all the processors supported by this document. If needed for clarity, the specific processor will be listed. In this document, when a reference is made to "the datasheet", the reader should refer to the Intel® Core™2 Extreme Processor QX9000 Series and Intel® Core™2 Quad Processor Q9000 Series Datasheet and Intel® Core™2 Extreme Quad-Core Processor QX6000Δ Sequence and Intel® Core™2 Quad Processor Q6000Δ Sequence Datasheet, as appropriate. If needed for clarity the specific processor datasheet will be referenced. Chapter 2 of this document discusses package thermal mechanical requirements to design a thermal solution for the processor in the context of personal computer applications. Chapter 3 discusses the thermal solution considerations and metrology recommendations to validate a processor thermal solution. Chapter 4 addresses the benefits of the processor's integrated thermal management logic for thermal design. Chapter 5 gives information on the Intel reference thermal solution called ALCT (Intel Advanced Liquid Cooling Technology) for the processor. Chapter 6 discusses the implementation of Intel® Quiet System Technology. The physical dimensions and thermal specifications of the processor that are used in this document are for illustration only. Refer to the datasheet for the product dimensions, thermal power dissipation and maximum case temperature. In case of conflict, the data in the datasheet supersedes any data in this document. 10 Thermal and Mechanical Design Guidelines

Section	Page
1 Introduction	9
1.1 Document Goals and Scope	9
1.1.1 Importance of Thermal Management	9
1.1.2 Document Goals	9
1.1.3 Document Scope	10
1.2 References	11
1.3 Definition of Terms	11
2 Processor Thermal/Mechanical Information	13
2.1 Mechanical Requirements	13
2.1.1 Processor Package	13
2.1.2 Heatsink Attach	15
2.1.2.1 General Guidelines	15
2.1.2.2 The Pump Assembly Clip Load Requirement	15
2.1.2.3 Additional Guidelines	16
2.2 Thermal Requirements	16
2.2.1 Processor Case Temperature	16
2.2.2 Thermal Profile	17
2.2.3 TCONTROL	18
2.3 Heatsink Design Considerations	19
2.3.1 Heatsink Size	20
2.3.2 Package IHS Flatness	20
2.3.3 Thermal Interface Material	21
2.4 System Thermal Solution Considerations	21
2.4.1 Chassis Thermal Design Capabilities	21
2.4.2 Improving Chassis Thermal Performance	21
2.4.3 Summary	22
2.5 System Integration Considerations	22
3 Thermal Metrology	23
3.1 Characterizing Cooling Performance Requirements	23
3.1.1 Example	25
3.2 Processor Thermal Solution Performance Assessment	26
3.3 Local Ambient Temperature Measurement Guidelines	26
3.4 Processor Case Temperature Measurement Guidelines	29
4 Thermal Management Logic and Thermal Monitor Feature	31
4.1 Processor Power Dissipation	31
4.2 Thermal Monitor Implementation	31
4.2.1 PROCHOT# Signal	32
4.2.2 Thermal Control Circuit	32
4.2.3 Thermal Monitor 2	33
4.2.4 Operation and Configuration	34
4.2.5 On-Demand Mode	35
4.2.6 System Considerations	35
4.2.7 Operating System and Application Software Considerations	36
4.2.8 THERMTRIP# Signal	36
4.2.9 Cooling System Failure Warning	36
4.2.10 Digital Thermal Sensor	37
4.2.11 Platform Environmental Control Interface (PECI)	38
5 Intel Thermal/Mechanical Reference Design Information	39
5.1 Validation Results for the ATX Reference Design	39
5.1.1 Heatsink Performance	40
5.1.2 Acoustics	40
5.1.3 Altitude	41
5.1.4 Reference Heatsink Thermal Validation	41
5.1.5 Fan Motor Performance	42
5.1.6 Pump Motor Performance	43
5.2 Environmental Reliability Testing	44
5.2.1 Structural Reliability Testing	44
5.2.1.1 Random Vibration Test Procedure	44
5.2.1.2 Shock Test Procedure	45
5.2.2 Power Cycling	46
5.2.3 Reliability Testing	46
5.2.3.1 Tubing Material Selection	48
5.2.3.2 Reservoir Sizing	48
5.2.3.3 Reliability Test Results	50
5.2.4 Recommended BIOS/CPU/Memory Test Procedures	51
5.3 Material and Recycling Requirements	52
5.4 Safety Requirements	52
5.5 Geometric Envelope for Intel Reference ATX Thermal Mechanical Design	52
5.6 Reference Attach Mechanism	54
5.7 Socket and Voltage Regulation Cooling Strategy	55
6 Intel® Quiet System Technology (Intel® QST)	57
6.1 Intel® Quiet System Technology Algorithm	57
6.1.1 Output Weighting Matrix	58
6.1.2 Proportional-Integral-Derivative (PID)	58
6.2 Board and System Implementation of Intel® Quiet System Technology	60
6.3 Intel® QST Configuration & Tuning	62