Intel QX9770 Design Guidelines - Page 37

Thermal Management Logic and Thermal Monitor Feature

Thermal and Mechanical Design Guidelines

37

4.2.10

Digital Thermal Sensor

The processor utilizes the Digital Thermal Sensor (DTS) as the on-die sensor to use

for fan speed control (FSC). The DTS replaces the on-die thermal diode used in

previous product. The DTS is monitoring the same sensor that activates the TCC

(See Section

4.2.2).

Readings from the DTS are relative to the activation of the TCC.

The DTS value where TCC activation occurs is 0 (zero).

The DTS can be accessed by two methods.

The first is via a MSR.

The value read via

the MSR is an unsigned number of degrees C away from TCC activation. The second

method which is expected to be the primary method for FSC is via the PECI interface.

The value of the DTS when read via the PECI interface is always negative and again is

degrees C away from TCC activation.

A T

CONTROL

value will be provided for use with DTS.

The usage model for T

CONTROL

with

the DTS is the same as with the on-die thermal diode:

•

If the Digital Thermometer is less than T

CONTROL,

the fan speed can be reduced.

•

If the Digital Thermometer is greater than or equal to T

CONTROL,

then T

C

must be

maintained at or below the Thermal Profile for the measured power dissipation.

The calculation of T

CONTROL

is slightly different from previous product.

There is no base

value to sum with the T

OFFSET

located in the same MSR as used in previous processors.

The BIOS only needs to read the T

OFFSET

MSR and provide this value to the fan speed

control device.

Figure 10. T

CONTROL

for Digital Thermometer

Multiple digital thermal sensors can be implemented within the package without

adding a pair of signal pins per sensor as required with the thermal diode.

The digital

thermal sensor is easier to place in thermally sensitive locations of the processor than

the thermal diode.

This is achieved due to a smaller foot print and decreased

sensitivity to noise.

Since the DTS is factory set on a per-part basis there is no need

for the health monitor components to be updated at each processor family.

Section	Page
1 Introduction	9
1.1 Document Goals and Scope	9
1.1.1 Importance of Thermal Management	9
1.1.2 Document Goals	9
1.1.3 Document Scope	10
1.2 References	11
1.3 Definition of Terms	11
2 Processor Thermal/Mechanical Information	13
2.1 Mechanical Requirements	13
2.1.1 Processor Package	13
2.1.2 Heatsink Attach	15
2.1.2.1 General Guidelines	15
2.1.2.2 The Pump Assembly Clip Load Requirement	15
2.1.2.3 Additional Guidelines	16
2.2 Thermal Requirements	16
2.2.1 Processor Case Temperature	16
2.2.2 Thermal Profile	17
2.2.3 TCONTROL	18
2.3 Heatsink Design Considerations	19
2.3.1 Heatsink Size	20
2.3.2 Package IHS Flatness	20
2.3.3 Thermal Interface Material	21
2.4 System Thermal Solution Considerations	21
2.4.1 Chassis Thermal Design Capabilities	21
2.4.2 Improving Chassis Thermal Performance	21
2.4.3 Summary	22
2.5 System Integration Considerations	22
3 Thermal Metrology	23
3.1 Characterizing Cooling Performance Requirements	23
3.1.1 Example	25
3.2 Processor Thermal Solution Performance Assessment	26
3.3 Local Ambient Temperature Measurement Guidelines	26
3.4 Processor Case Temperature Measurement Guidelines	29
4 Thermal Management Logic and Thermal Monitor Feature	31
4.1 Processor Power Dissipation	31
4.2 Thermal Monitor Implementation	31
4.2.1 PROCHOT# Signal	32
4.2.2 Thermal Control Circuit	32
4.2.3 Thermal Monitor 2	33
4.2.4 Operation and Configuration	34
4.2.5 On-Demand Mode	35
4.2.6 System Considerations	35
4.2.7 Operating System and Application Software Considerations	36
4.2.8 THERMTRIP# Signal	36
4.2.9 Cooling System Failure Warning	36
4.2.10 Digital Thermal Sensor	37
4.2.11 Platform Environmental Control Interface (PECI)	38
5 Intel Thermal/Mechanical Reference Design Information	39
5.1 Validation Results for the ATX Reference Design	39
5.1.1 Heatsink Performance	40
5.1.2 Acoustics	40
5.1.3 Altitude	41
5.1.4 Reference Heatsink Thermal Validation	41
5.1.5 Fan Motor Performance	42
5.1.6 Pump Motor Performance	43
5.2 Environmental Reliability Testing	44
5.2.1 Structural Reliability Testing	44
5.2.1.1 Random Vibration Test Procedure	44
5.2.1.2 Shock Test Procedure	45
5.2.2 Power Cycling	46
5.2.3 Reliability Testing	46
5.2.3.1 Tubing Material Selection	48
5.2.3.2 Reservoir Sizing	48
5.2.3.3 Reliability Test Results	50
5.2.4 Recommended BIOS/CPU/Memory Test Procedures	51
5.3 Material and Recycling Requirements	52
5.4 Safety Requirements	52
5.5 Geometric Envelope for Intel Reference ATX Thermal Mechanical Design	52
5.6 Reference Attach Mechanism	54
5.7 Socket and Voltage Regulation Cooling Strategy	55
6 Intel® Quiet System Technology (Intel® QST)	57
6.1 Intel® Quiet System Technology Algorithm	57
6.1.1 Output Weighting Matrix	58
6.1.2 Proportional-Integral-Derivative (PID)	58
6.2 Board and System Implementation of Intel® Quiet System Technology	60
6.3 Intel® QST Configuration & Tuning	62

Intel QX9770 Design Guidelines - Page 37

Digital Thermal Sensor, T, for Digital Thermometer

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