Intel QX9770 Design Guidelines - Page 11

References, 1.3 Definition of Terms, Document, Location, Description - used

Get Intel QX9770 - Core 2 Extreme Quad-Core Processor PDF manuals and user guides
UPC - 735858197564
View all Intel QX9770 manuals
Add to My Manuals
Save this manual to your list of manuals

Page 11 highlights

Introduction 1.2 1.3 References Material and concepts available in the following documents may be beneficial when reading this document. Document Intel® Core™2 Extreme Processor QX9000 Series and Intel® Core™2 Quad Processor Q9000 Series Datasheet Intel® Core™2 Extreme Quad-Core Processor QX6000Δ Sequence and Intel® Core™2 Quad Processor Q6000Δ Sequence Datasheet LGA775 Socket Mechanical Design Guide Fan Specification for 4-wire PWM Controlled Fans ATX Thermal Design Suggestions microATX Thermal Design Suggestions Balanced Technology Extended (BTX) System Design Guide Location http://w.ww.intel.com/design/pro cessor/datashts/318726.htm http://developer.intel.com/design /processor/datashts/315592.htm http://intel.com/design/ Pentium4/guides/ 302666.htm http://www.formfactors.org/ http://www.formfactors.org/ http://www.formfactors.org/ http://www.formfactors.org/ Definition of Terms Term Description TA TC TE TS TC-MAX TLIQUID ΨCA ΨCS ΨSA The measured ambient temperature locally surrounding the processor. The ambient temperature should be measured just upstream of a passive heatsink or at the fan inlet for an active heatsink. The case temperature of the processor, measured at the geometric center of the topside of the IHS. The ambient air temperature external to a system chassis. This temperature is usually measured at the chassis air inlets. Heatsink temperature measured on the underside of the heatsink base, at a location corresponding to TC. The maximum case temperature as specified in a component specification. Working fluid temperature as it leaves the pump (or enters the heat exchanger). Case-to-ambient thermal characterization parameter (psi). A measure of thermal solution performance using total package power. Defined as (TC - TA) / Total Package Power. Note: Heat source must be specified for Ψ measurements. Case-to-sink thermal characterization parameter. A measure of thermal interface material performance using total package power. Defined as (TC - TS) / Total Package Power. Note: Heat source must be specified for Ψ measurements. Sink-to-ambient thermal characterization parameter. A measure of heatsink thermal performance using total package power. Defined as (TS - TA) / Total Package Power. Note: Heat source must be specified for Ψ measurements. Thermal and Mechanical Design Guidelines 11

  • 1
  • 2
  • 3
  • 4
  • 5
  • 6
  • 7
  • 8
  • 9
  • 10
  • 11
  • 12
  • 13
  • 14
  • 15
  • 16
  • 17
  • 18
  • 19
  • 20
  • 21
  • 22
  • 23
  • 24
  • 25
  • 26
  • 27
  • 28
  • 29
  • 30
  • 31
  • 32
  • 33
  • 34
  • 35
  • 36
  • 37
  • 38
  • 39
  • 40
  • 41
  • 42
  • 43
  • 44
  • 45
  • 46
  • 47
  • 48
  • 49
  • 50
  • 51
  • 52
  • 53
  • 54
  • 55
  • 56
  • 57
  • 58
  • 59
  • 60
  • 61
  • 62
  • 63
  • 64
  • 65
  • 66
  • 67
  • 68
  • 69
  • 70
  • 71
  • 72
  • 73
  • 74
  • 75
  • 76
  • 77
  • 78
  • 79
  • 80
  • 81
  • 82
  • 83
  • 84
  • 85
  • 86
  • 87
  • 88
  • 89
  • 90
  • 91
  • 92
  • 93
  • 94
  • 95
  • 96
  • 97
  • 98
  • 99
  • 100
  • 101
  • 102
  • 103
  • 104
  • 105
  • 106
  • 107
  • 108
  • 109
  • 110
  • 111
  • 112
  • 113
  • 114
  • 115
  • 116
  • 117
  • 118
  • 119
  • 120
  • 121
  • 122
  • 123
Introduction
Thermal and Mechanical Design Guidelines
11
1.2
References
Material and concepts available in the following documents may be beneficial when
reading this document.
Document
Location
Intel
®
Core™2 Extreme Processor QX9000 Series and Intel
®
Core™2 Quad Processor Q9000 Series Datasheet
cessor/datashts/318726.htm
Intel
®
Core™2 Extreme Quad-Core Processor QX6000
Δ
Sequence and Intel
®
Core™2 Quad Processor Q6000
Δ
Sequence
Datasheet
/processor/datashts/315592.htm
LGA775 Socket Mechanical Design Guide
http://intel.com/design/
Pentium4/guides/ 302666.htm
Fan Specification for 4-wire PWM Controlled Fans
ATX Thermal Design Suggestions
microATX Thermal Design Suggestions
Balanced Technology Extended (BTX) System Design Guide
1.3
Definition of Terms
Term
Description
T
A
The measured ambient temperature locally surrounding the processor. The ambient
temperature should be measured just upstream of a passive heatsink or at the fan
inlet for an active heatsink.
T
C
The case temperature of the processor, measured at the geometric center of the
topside of the IHS.
T
E
The ambient air temperature external to a system chassis. This temperature is usually
measured at the chassis air inlets.
T
S
Heatsink temperature measured on the underside of the heatsink base, at a location
corresponding to
T
C
.
T
C-MAX
The maximum case temperature as specified in a component specification.
T
LIQUID
Working fluid temperature as it leaves the pump (or enters the heat exchanger).
Ψ
CA
Case-to-ambient thermal characterization parameter (psi). A measure of thermal
solution performance using total package power. Defined as (T
C
– T
A
) / Total Package
Power.
Note:
Heat source must be specified for
Ψ
measurements.
Ψ
CS
Case-to-sink thermal characterization parameter. A measure of thermal interface
material performance using total package power. Defined as (T
C
– T
S
) / Total Package
Power.
Note:
Heat source must be specified for
Ψ
measurements.
Ψ
SA
Sink-to-ambient thermal characterization parameter. A measure of heatsink thermal
performance using total package power. Defined as (T
S
– T
A
) / Total Package Power.
Note:
Heat source must be specified for
Ψ
measurements.