Intel QX9770 Design Guidelines - Page 6

LGA775 Socket Heatsink Loading Figures Figure 1. Package IHS Load Areas 13 Figure 2. Processor Case Temperature Measurement Location 17 Figure 3. Example Thermal Profile 18 Figure 4. Processor Thermal Characterization Parameter Relationships 24 Figure 5. Locations for Measuring Local Ambient Temperature, Active Heatsink ........27 Figure 6. Locations for Measuring Local Ambient Temperature, Liquid-Cooling Heat Exchanger 28 Figure 7. Locations for Measuring Local Ambient Temperature, Passive Heatsink ......28 Figure 8. Concept for Clocks under Thermal Monitor Control 33 Figure 9. Thermal Monitor 2 Frequency and Voltage Ordering 34 Figure 10. TCONTROL for Digital Thermometer 37 Figure 11. Random Vibration PSD 44 Figure 12. Shock Acceleration Curve 45 Figure 13. The Assembly Cumulative Mass Loss Data in Continuous Operation Test at 50 ºC and 1450 RPM 49 Figure 14. Thermal Resistance Curve for Liquid Loss of Reservoir 49 Figure 15. Reservoir Location 50 Figure 16. Intel® ALCT Reference Design Major Components 53 Figure 17. Heat Exchanger Fan Combination Foot Print View 53 Figure 18. Structure to Motherboard Interface 54 Figure 19. Diagram of Location of Heat Exchanger VR and Socket Airflow Cooling Feature 55 Figure 20. CPU Maximum Current Draw for Heat Exchanger Fan Speed 56 Figure 21. Intel® Quiet System Technology Overview 58 Figure 22. PID Controller Fundamentals 59 Figure 23. Intel® Quiet System Technology Platform Requirements 60 Figure 24. Example Acoustic Fan Speed Control Implementation 61 Figure 25. Digital Thermal Sensor and Thermistor 62 Figure 26. Board Deflection Definition 65 Figure 27. Example: Defining Heatsink Preload Meeting Board Deflection Limit ........67 Figure 28. Load Cell Installation in Machined Heatsink Base Pocket - Bottom View ...70 Figure 29. Load Cell Installation in Machined Heatsink Base Pocket - Side View .......71 Figure 30. Preload Test Configuration 71 Figure 31. Omega Thermocouple 79 Figure 32. 775-LAND LGA Package Reference Groove Drawing 80 Figure 33. IHS Groove on the 775-LAND LGA Package 81 Figure 34. IHS Groove Orientation Relative to the LGA775 Socket 81 Figure 35. Inspection of Insulation on Thermocouple 82 Figure 36. Bending the Tip of the Thermocouple 83 Figure 37. Securing Thermocouple Wires with Kapton* Tape Prior to Attach 83 Figure 38. Thermocouple Bead Placement 84 Figure 39. Position Bead on the Groove Step 85 Figure 44. Detailed Thermocouple Bead Placement 85 Figure 41. Third Tape Installation 86 Figure 42. Measuring Resistance between Thermocouple and IHS 86 Figure 43. Applying Flux to the Thermocouple Bead 87 Figure 44. Cutting Solder 87 Figure 45. Positioning Solder on IHS 88 Figure 46. Solder Station Setup 89 Figure 47. View Through Lens at Solder Station 90 Figure 48. Moving Solder back onto Thermocouple Bead 90 6 Thermal and Mechanical Design Guidelines