Intel QX9770 Design Guidelines - Page 62

LGA775 Socket Heatsink Loading

62

Thermal and Mechanical Design Guidelines

6.3

Intel

®

QST Configuration & Tuning

Initial configuration of the Intel QST is the responsibility of the board manufacturer.

The SPI flash should be programmed with the hardware configuration of the

motherboard and initial settings for fan control, fan monitoring, voltage and thermal

monitoring.

This initial data is generated using the Intel provided Configuration Tool

At the system integrator the Configuration Tool can be used again but this time to

tune the Intel QST subsystem to reflect the shipping system configuration.

In the

tuning process the Intel QST can be modified to have the proper relationships between

the installed fans and sensors in the shipping system.

A Weighting Matrix Utility and

Intel QST Log program are planned to assist in optimizing the fan management and

achieve acoustic goal.

See your Intel field sales representative for availability of these tools.

6.4

Fan Hub Thermistor and Intel

®

QST

There is no closed loop control between Intel QST and the thermistor, but they can

work in tandem to provide the maximum fan speed reduction.

The BTX reference

design includes a thermistor on the fan hub.

This Variable Speed Fan curve will

determine the maximum fan speed as a function of the inlet ambient temperature and

by design provides a

Ψ

CA

sufficient to meet the thermal profile of the processor.

Intel

QST, by measuring the processor digital thermal sensor will command the fan to

reduce speed below the VSF curve in response to processor workload.

Conversely if

the processor workload increases, the FSC will command the fan via the PWM duty

cycle to accelerate the fan up to the limit imposed by the VSF curve.

Care needs to

be taken in BTX designs to ensure the fan speed at the minimum operating speed that

sufficient air flow is being provided to support the other system components.

Figure 25. Digital Thermal Sensor and Thermistor

Fan Speed

(RPM)

Inlet Temperature (°C)

Full

Speed

30

38

Min.

Operating

Variable Speed Fan

(VSF) Curve

Fan Speed

Operating Range

with FSC

34

Min %

Fan Speed

(% PWM Duty Cycle)

100 %

Fan Speed

(RPM)

Inlet Temperature (°C)

Full

Speed

30

38

Min.

Operating

Variable Speed Fan

(VSF) Curve

Fan Speed

Operating Range

with FSC

34

Min %

Fan Speed

(% PWM Duty Cycle)

100 %

§

Section	Page
1 Introduction	9
1.1 Document Goals and Scope	9
1.1.1 Importance of Thermal Management	9
1.1.2 Document Goals	9
1.1.3 Document Scope	10
1.2 References	11
1.3 Definition of Terms	11
2 Processor Thermal/Mechanical Information	13
2.1 Mechanical Requirements	13
2.1.1 Processor Package	13
2.1.2 Heatsink Attach	15
2.1.2.1 General Guidelines	15
2.1.2.2 The Pump Assembly Clip Load Requirement	15
2.1.2.3 Additional Guidelines	16
2.2 Thermal Requirements	16
2.2.1 Processor Case Temperature	16
2.2.2 Thermal Profile	17
2.2.3 TCONTROL	18
2.3 Heatsink Design Considerations	19
2.3.1 Heatsink Size	20
2.3.2 Package IHS Flatness	20
2.3.3 Thermal Interface Material	21
2.4 System Thermal Solution Considerations	21
2.4.1 Chassis Thermal Design Capabilities	21
2.4.2 Improving Chassis Thermal Performance	21
2.4.3 Summary	22
2.5 System Integration Considerations	22
3 Thermal Metrology	23
3.1 Characterizing Cooling Performance Requirements	23
3.1.1 Example	25
3.2 Processor Thermal Solution Performance Assessment	26
3.3 Local Ambient Temperature Measurement Guidelines	26
3.4 Processor Case Temperature Measurement Guidelines	29
4 Thermal Management Logic and Thermal Monitor Feature	31
4.1 Processor Power Dissipation	31
4.2 Thermal Monitor Implementation	31
4.2.1 PROCHOT# Signal	32
4.2.2 Thermal Control Circuit	32
4.2.3 Thermal Monitor 2	33
4.2.4 Operation and Configuration	34
4.2.5 On-Demand Mode	35
4.2.6 System Considerations	35
4.2.7 Operating System and Application Software Considerations	36
4.2.8 THERMTRIP# Signal	36
4.2.9 Cooling System Failure Warning	36
4.2.10 Digital Thermal Sensor	37
4.2.11 Platform Environmental Control Interface (PECI)	38
5 Intel Thermal/Mechanical Reference Design Information	39
5.1 Validation Results for the ATX Reference Design	39
5.1.1 Heatsink Performance	40
5.1.2 Acoustics	40
5.1.3 Altitude	41
5.1.4 Reference Heatsink Thermal Validation	41
5.1.5 Fan Motor Performance	42
5.1.6 Pump Motor Performance	43
5.2 Environmental Reliability Testing	44
5.2.1 Structural Reliability Testing	44
5.2.1.1 Random Vibration Test Procedure	44
5.2.1.2 Shock Test Procedure	45
5.2.2 Power Cycling	46
5.2.3 Reliability Testing	46
5.2.3.1 Tubing Material Selection	48
5.2.3.2 Reservoir Sizing	48
5.2.3.3 Reliability Test Results	50
5.2.4 Recommended BIOS/CPU/Memory Test Procedures	51
5.3 Material and Recycling Requirements	52
5.4 Safety Requirements	52
5.5 Geometric Envelope for Intel Reference ATX Thermal Mechanical Design	52
5.6 Reference Attach Mechanism	54
5.7 Socket and Voltage Regulation Cooling Strategy	55
6 Intel® Quiet System Technology (Intel® QST)	57
6.1 Intel® Quiet System Technology Algorithm	57
6.1.1 Output Weighting Matrix	58
6.1.2 Proportional-Integral-Derivative (PID)	58
6.2 Board and System Implementation of Intel® Quiet System Technology	60
6.3 Intel® QST Configuration & Tuning	62

Intel QX9770 Design Guidelines - Page 62

Intel® QST Configuration & Tuning, Digital Thermal Sensor and Thermistor

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