Intel QX9770 Design Guidelines - Page 17

Processor Thermal/Mechanical Information

Thermal and Mechanical Design Guidelines

17

Figure 2. Processor Case Temperature Measurement Location

37.5 mm

Measure T

C

at this point

(geometric center of the package)

37.5 mm

37.5 mm

Measure T

C

at this point

(geometric center of the package)

37.5 mm

2.2.2

Thermal Profile

The Thermal Profile defines the maximum case temperature as a function of processor

power dissipation. Refer to the datasheet for the further information.

While the thermal profile provides flexibility for ATX /BTX thermal design based on its

intended target thermal environment, thermal solutions that are intended to function

in a multitude of systems and environments need to be designed for the worst-case

thermal environment. The majority of ATX /BTX platforms are targeted to function in

an environment that will have up to a 35 °C ambient temperature external to the

system.

For ATX platforms using the Intel

®

Core™2 Extreme processor QX6800 B3 stepping

and QX9770 C0 stepping, an active liquid-cooled design should be designed to

manage the heat exchanger inlet temperature of 35 ºC + 3 ºC = 38 ºC (see

Chapter

5).

For BTX platforms, the similar BTX liquid cooling design should be designed to manage

the heat exchanger inlet temperature of 35 ºC + 0.5 ºC = 35.5 ºC.

The slope of the thermal profile was established to be the same as the Intel liquid

cooling solution thermal solution performance. This performance is expressed as the

slope on the thermal profile and can be thought of as the thermal resistance of the

heatsink attached to the processor,

Ψ

CA

(Refer to Section

3.1).

The intercept on the

thermal profile assumes a maximum ambient operating condition that is consistent

with the available chassis solutions.

The thermal profiles for the processor are defined such that a single thermal solution

(e.g., ALCT reference design) can be used for Intel

®

Core™2 Extreme processor

QX6800 B3 Stepping and QX9770 C0 Stepping processors. See Chapter

5 for a

discussion of the ALCT reference design. To determine compliance to the thermal

profile, a measurement of the actual processor power dissipation is required.

The

measured power is plotted on the Thermal Profile to determine the maximum case

Section	Page
1 Introduction	9
1.1 Document Goals and Scope	9
1.1.1 Importance of Thermal Management	9
1.1.2 Document Goals	9
1.1.3 Document Scope	10
1.2 References	11
1.3 Definition of Terms	11
2 Processor Thermal/Mechanical Information	13
2.1 Mechanical Requirements	13
2.1.1 Processor Package	13
2.1.2 Heatsink Attach	15
2.1.2.1 General Guidelines	15
2.1.2.2 The Pump Assembly Clip Load Requirement	15
2.1.2.3 Additional Guidelines	16
2.2 Thermal Requirements	16
2.2.1 Processor Case Temperature	16
2.2.2 Thermal Profile	17
2.2.3 TCONTROL	18
2.3 Heatsink Design Considerations	19
2.3.1 Heatsink Size	20
2.3.2 Package IHS Flatness	20
2.3.3 Thermal Interface Material	21
2.4 System Thermal Solution Considerations	21
2.4.1 Chassis Thermal Design Capabilities	21
2.4.2 Improving Chassis Thermal Performance	21
2.4.3 Summary	22
2.5 System Integration Considerations	22
3 Thermal Metrology	23
3.1 Characterizing Cooling Performance Requirements	23
3.1.1 Example	25
3.2 Processor Thermal Solution Performance Assessment	26
3.3 Local Ambient Temperature Measurement Guidelines	26
3.4 Processor Case Temperature Measurement Guidelines	29
4 Thermal Management Logic and Thermal Monitor Feature	31
4.1 Processor Power Dissipation	31
4.2 Thermal Monitor Implementation	31
4.2.1 PROCHOT# Signal	32
4.2.2 Thermal Control Circuit	32
4.2.3 Thermal Monitor 2	33
4.2.4 Operation and Configuration	34
4.2.5 On-Demand Mode	35
4.2.6 System Considerations	35
4.2.7 Operating System and Application Software Considerations	36
4.2.8 THERMTRIP# Signal	36
4.2.9 Cooling System Failure Warning	36
4.2.10 Digital Thermal Sensor	37
4.2.11 Platform Environmental Control Interface (PECI)	38
5 Intel Thermal/Mechanical Reference Design Information	39
5.1 Validation Results for the ATX Reference Design	39
5.1.1 Heatsink Performance	40
5.1.2 Acoustics	40
5.1.3 Altitude	41
5.1.4 Reference Heatsink Thermal Validation	41
5.1.5 Fan Motor Performance	42
5.1.6 Pump Motor Performance	43
5.2 Environmental Reliability Testing	44
5.2.1 Structural Reliability Testing	44
5.2.1.1 Random Vibration Test Procedure	44
5.2.1.2 Shock Test Procedure	45
5.2.2 Power Cycling	46
5.2.3 Reliability Testing	46
5.2.3.1 Tubing Material Selection	48
5.2.3.2 Reservoir Sizing	48
5.2.3.3 Reliability Test Results	50
5.2.4 Recommended BIOS/CPU/Memory Test Procedures	51
5.3 Material and Recycling Requirements	52
5.4 Safety Requirements	52
5.5 Geometric Envelope for Intel Reference ATX Thermal Mechanical Design	52
5.6 Reference Attach Mechanism	54
5.7 Socket and Voltage Regulation Cooling Strategy	55
6 Intel® Quiet System Technology (Intel® QST)	57
6.1 Intel® Quiet System Technology Algorithm	57
6.1.1 Output Weighting Matrix	58
6.1.2 Proportional-Integral-Derivative (PID)	58
6.2 Board and System Implementation of Intel® Quiet System Technology	60
6.3 Intel® QST Configuration & Tuning	62

Intel QX9770 Design Guidelines - Page 17

Thermal Profile, Processor Case Temperature Measurement Location

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