HP 540 HP 540 Notebook PC and HP 541 Notebook PC - Maintenance and Service Gui - Page 81
Heat sink, Remove the heat sink
View all HP 540 manuals
Add to My Manuals
Save this manual to your list of manuals |
Page 81 highlights
Heat sink NOTE: The heat sink spare part kits include replacement thermal material. Replacement thermal material is also available in the Thermal Material Kit, spare part numbers 456605-001 and 456606-001. Description For use only with computer models equipped with UMA graphics subsystem For use only with computer models equipped with discrete graphics subsystem Spare part number 456605-001 456606-001 Before removing the heat sink, follow these steps: 1. Shut down the computer. If you are unsure whether the computer is off or in Hibernation, turn the computer on, and then shut it down through the operating system. 2. Disconnect all external devices connected to the computer. 3. Disconnect the power from the computer by first unplugging the power cord from the AC outlet and then unplugging the AC adapter from the computer. 4. Remove the battery (see Battery on page 37). 5. Remove the following components: a. Hard drive (see Hard drive on page 38) b. Optical drive (see Optical drive on page 45) c. Keyboard (see Switch cover and keyboard on page 47) d. Switch cover (see Switch cover and keyboard on page 47) e. Speaker (see Speaker on page 51) f. Display lid switch module (see Display lid switch module on page 52) g. Display assembly (see Display assembly on page 53) h. Top cover (see Top cover on page 58) i. System board (see System board on page 66) Remove the heat sink: 1. Turn the system board upside down, with the USB connectors toward you. NOTE: Steps 2 and 3 apply only to computer models equipped with graphics subsystems having discrete memory. See steps 4 and 5 for removing the heat sink on computer models with graphics subsystems having UMA memory. 2. Following the 1, 2, 3, 4, 5, 6 sequence stamped into the heat sink, loosen the six Phillips PM2.5×10.0 screws (1) that secure the heat sink to the system board. Component replacement procedures 71