HP 540 HP 540 Notebook PC and HP 541 Notebook PC - Maintenance and Service Gui - Page 82

processor spare part kits.

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3. Remove the heat sink (2). NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink (1), (2), and (3), and the system board components (4), (5), and (6) each time the heat sink is removed. Thermal pads and thermal paste must be installed on all surfaces before the heat sink assembly is reinstalled. Replacement thermal material is included with all heat sink, system board, and processor spare part kits. NOTE: Steps 4 and 5 apply only to computer models equipped with graphics subsystems with UMA memory. 4. Following the 1, 2, 3, 4, sequence stamped into the heat sink, loosen the four Phillips PM2.5×10.0 screws (1) that secure the heat sink to the system board. 72 Chapter 4 Removal and replacement procedures

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3.
Remove the heat sink
(2)
.
NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the heat sink
(1)
,
(2)
, and
(3)
, and the system board components
(4)
,
(5)
, and
(6)
each time the heat sink is removed.
Thermal pads and thermal paste must be installed on all surfaces before the heat sink assembly
is reinstalled. Replacement thermal material is included with all heat sink, system board, and
processor spare part kits.
NOTE:
Steps 4 and 5 apply only to computer models equipped with graphics subsystems with
UMA memory.
4.
Following the 1, 2, 3, 4, sequence stamped into the heat sink, loosen the four Phillips PM2.5×10.0
screws
(1)
that secure the heat sink to the system board.
72
Chapter 4
Removal and replacement procedures