HP Dv71270us Service Guide - Page 112

and processor spare part kits., that service

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NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board each time the heat sink is removed. Thermal paste is used on the processor (1) and the heat sink section (2) that services it. Thermal pads are used on the Northbridge chip (3), the video memory chip (4), and the system board capacitors (5), and the sections of the heat sink (6) that service these components. Replacement thermal material is included with all heat sink assembly, system board, and processor spare part kits. The following illustration shows the replacement thermal material locations for computer models equipped with an AMD processor. NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board each time the heat sink is removed. Thermal paste is used on the processor (1) and the heat sink section (2) that services it. Thermal pads are used on the Northbridge chip (3), the video memory chip (4), and the system board capacitors (5), and the sections of the heat sink (6) that service these components. Replacement thermal material is included with all heat sink assembly, system board, and processor spare part kits. The following illustration shows the replacement thermal material locations for computer models equipped with an Intel processor. 104 Chapter 4 Removal and replacement procedures

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NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the
system board each time the heat sink is removed. Thermal paste is used on the processor
(1)
and the
heat sink section
(2)
that services it. Thermal pads are used on the Northbridge chip
(3)
, the video
memory chip
(4)
, and the system board capacitors
(5)
, and the sections of the heat sink
(6)
that service
these components. Replacement thermal material is included with all heat sink assembly, system board,
and processor spare part kits.
The following illustration shows the replacement thermal material locations for computer models
equipped with an AMD processor.
NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the
system board each time the heat sink is removed. Thermal paste is used on the processor
(1)
and the
heat sink section
(2)
that services it. Thermal pads are used on the Northbridge chip
(3)
, the video
memory chip
(4)
, and the system board capacitors
(5)
, and the sections of the heat sink
(6)
that service
these components. Replacement thermal material is included with all heat sink assembly, system board,
and processor spare part kits.
The following illustration shows the replacement thermal material locations for computer models
equipped with an Intel processor.
104
Chapter 4
Removal and replacement procedures