HP ENVY dv6-7213nr HP ENVY dv6 Notebook PC Maintenance and Service Guide IMPOR - Page 94

Thermal paste is used on the graphics subsystem chip, that services

Get HP ENVY dv6-7213nr PDF manuals and user guides View all HP ENVY dv6-7213nr manuals
Add to My Manuals
Save this manual to your list of manuals

Page 94 highlights

NOTE: The following illustration shows the replacement thermal material locations on a computer model equipped with an AMD processor and a graphics subsystem with UMA memory. Thermal paste is used on the processor (1) and the heat sink section (2) that services it. NOTE: The following illustration shows the replacement thermal material locations on a computer model equipped with an Intel processor and a graphics subsystem with discrete memory. ● Thermal paste is used on the processor (1) and the heat sink section (2) that services it ● Thermal paste is used on the graphics subsystem chip (3) and the heat sink section (4) that services it ● Thermal pads are used on the system board components (5) and the heat sink sections (6) that service them 86 Chapter 4 Removal and replacement procedures

  • 1
  • 2
  • 3
  • 4
  • 5
  • 6
  • 7
  • 8
  • 9
  • 10
  • 11
  • 12
  • 13
  • 14
  • 15
  • 16
  • 17
  • 18
  • 19
  • 20
  • 21
  • 22
  • 23
  • 24
  • 25
  • 26
  • 27
  • 28
  • 29
  • 30
  • 31
  • 32
  • 33
  • 34
  • 35
  • 36
  • 37
  • 38
  • 39
  • 40
  • 41
  • 42
  • 43
  • 44
  • 45
  • 46
  • 47
  • 48
  • 49
  • 50
  • 51
  • 52
  • 53
  • 54
  • 55
  • 56
  • 57
  • 58
  • 59
  • 60
  • 61
  • 62
  • 63
  • 64
  • 65
  • 66
  • 67
  • 68
  • 69
  • 70
  • 71
  • 72
  • 73
  • 74
  • 75
  • 76
  • 77
  • 78
  • 79
  • 80
  • 81
  • 82
  • 83
  • 84
  • 85
  • 86
  • 87
  • 88
  • 89
  • 90
  • 91
  • 92
  • 93
  • 94
  • 95
  • 96
  • 97
  • 98
  • 99
  • 100
  • 101
  • 102
  • 103
  • 104
  • 105
  • 106
  • 107
  • 108
  • 109
  • 110
  • 111
  • 112
  • 113
  • 114
  • 115
  • 116
  • 117
  • 118
  • 119
  • 120
  • 121
  • 122
  • 123
  • 124
  • 125
  • 126
  • 127
  • 128
  • 129
  • 130
NOTE:
The following illustration shows the replacement thermal material locations on a computer
model equipped with an AMD processor and a graphics subsystem with UMA memory. Thermal paste
is used on the processor
(1)
and the heat sink section
(2)
that services it.
NOTE:
The following illustration shows the replacement thermal material locations on a computer
model equipped with an Intel processor and a graphics subsystem with discrete memory.
●
Thermal paste is used on the processor
(1)
and the heat sink section
(2)
that services it
●
Thermal paste is used on the graphics subsystem chip
(3)
and the heat sink section
(4)
that
services it
●
Thermal pads are used on the system board components
(5)
and the heat sink sections
(6)
that
service them
86
Chapter 4
Removal and replacement procedures