Intel BOXD955XCSLKR Product Specification - Page 71

Thermal Considerations

Get Intel BOXD955XCSLKR - Motherboard 955X Express Chipset BTX PDF manuals and user guides
UPC - 735858173834
View all Intel BOXD955XCSLKR manuals
Add to My Manuals
Save this manual to your list of manuals

Page 71 highlights

Technical Reference 2.11 Thermal Considerations This board features a thermal protection circuit in the processor voltage regulator area. This circuit protects the processor voltage regulator from overheating and damaging the board. The thermal protection circuit in the processor voltage regulator sensor is triggered at approximately 120 oC. This trigger will cause the processor to enter a throttling mode (slowing down the processor if it exceeds its maximum operating temperature) and allow the processor voltage regulator to cool down. # INTEGRATOR'S NOTE Use a processor heatsink that provides omni-directional airflow (similar to the type shown in Figure 27) to maintain required airflow across the processor voltage regulator area. OM16996 Figure 27. Example of a Processor Heatsink for Omni-directional Airflow CAUTION When using BIOS Setup program options to increase processor voltage and frequency above the supported ranges, the temperature in the processor voltage regulator area will rise. This area of the board (item E in Figure 28) will require increased airflow. Direct airflow over the processor voltage regulator is crucial to preventing throttling and keeping the processor voltage regulator area cool. This is particularly important when using liquid cooling. All responsibility for determining the adequacy of any thermal or system design remains solely with the reader. Intel makes no warranties or representations that merely following the instructions presented in this document will result in a system with adequate thermal performance. Figure 28 shows the locations of the localized high temperature zones. 71

  • 1
  • 2
  • 3
  • 4
  • 5
  • 6
  • 7
  • 8
  • 9
  • 10
  • 11
  • 12
  • 13
  • 14
  • 15
  • 16
  • 17
  • 18
  • 19
  • 20
  • 21
  • 22
  • 23
  • 24
  • 25
  • 26
  • 27
  • 28
  • 29
  • 30
  • 31
  • 32
  • 33
  • 34
  • 35
  • 36
  • 37
  • 38
  • 39
  • 40
  • 41
  • 42
  • 43
  • 44
  • 45
  • 46
  • 47
  • 48
  • 49
  • 50
  • 51
  • 52
  • 53
  • 54
  • 55
  • 56
  • 57
  • 58
  • 59
  • 60
  • 61
  • 62
  • 63
  • 64
  • 65
  • 66
  • 67
  • 68
  • 69
  • 70
  • 71
  • 72
  • 73
  • 74
  • 75
  • 76
  • 77
  • 78
  • 79
  • 80
  • 81
  • 82
  • 83
  • 84
  • 85
  • 86
  • 87
  • 88
  • 89
  • 90
  • 91
  • 92
Technical Reference
71
2.11 Thermal Considerations
This board features a thermal protection circuit in the processor voltage regulator area.
This circuit
protects the processor voltage regulator from overheating and damaging the board.
The thermal
protection circuit in the processor voltage regulator sensor is triggered at approximately 120
o
C.
This trigger will cause the processor to enter a throttling mode (slowing down the processor if it
exceeds its maximum operating temperature) and allow the processor voltage regulator to cool
down.
INTEGRATOR’S NOTE
Use a processor heatsink that provides omni-directional airflow (similar to the type shown in
Figure 27) to maintain required airflow across the processor voltage regulator area.
OM16996
Figure 27.
Example of a Processor Heatsink for Omni-directional Airflow
CAUTION
When using BIOS Setup program options to increase processor voltage and frequency above the
supported ranges, the temperature in the processor voltage regulator area will rise.
This area of
the board (item E in Figure 28) will require increased airflow.
Direct airflow over the processor
voltage regulator is crucial to preventing throttling and keeping the processor voltage regulator
area cool.
This is particularly important when using liquid cooling.
All responsibility for determining the adequacy of any thermal or system design remains solely with
the reader.
Intel makes no warranties or representations that merely following the instructions
presented in this document will result in a system with adequate thermal performance.
Figure 28 shows the locations of the localized high temperature zones.