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Intel BOXD955XCSLKR Product Specification - Page 74

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Intel Desktop Board D955XCS Technical Product Specification 2.13 Environmental Table 37 lists the environmental specifications for the board. Table 37. Environmental Specifications Parameter Temperature Non-Operating Operating Shock Unpackaged Packaged Vibration Unpackaged Packaged Specification -40 °C to +70 °C 0 °C to +55 °C 50 g trapezoidal waveform Velocity change of 170 inches/second Half sine 2 millisecond Product Weight (pounds) Free Fall (inches)

Section	Page
Intel® Desktop Board D955XCS Technical Product Specification	1
Revision History / Disclaimer	2
Preface	3
Intended Audience	3
What This Document Contains	3
Typographical Conventions	3
Contents	5
1 Product Description	9
1.1 Overview	10
1.1.1 Feature Summary	10
1.1.2 Manufacturing Options	11
1.1.3 Board Layout	12
1.1.4 Block Diagram	14
1.2 Online Support	15
1.3 Processor	15
1.4 System Memory	16
1.4.1 Memory Configurations	17
1.5 Intel® 955X Chipset	21
1.5.1 USB	21
1.5.2 IDE Support	21
1.5.3 Real-Time Clock, CMOS SRAM, and Battery	23
1.6 Discrete Serial ATA Interface (Optional)	24
1.7 PCI Express* Connectors	24
1.8 Auxiliary Power (AUX PWR) Connector (Optional)	25
1.9 IEEE-1394a/b Connectors (Optional)	25
1.10 Legacy I/O Controller	26
1.10.1 Serial Port	26
1.10.2 Parallel Port	26
1.10.3 Diskette Drive Controller	26
1.10.4 Keyboard and Mouse Interface	26
1.11 Audio Subsystem	27
1.11.1 Audio Subsystem Software	27
1.11.2 Audio Connectors	27
1.11.3 8-Channel (7.1) Audio Subsystem	28
1.11.4 6-Channel (5.1) Audio Subsystem	30
1.12 LAN Subsystem	31
1.12.1 Intel® 82573E/82573V Gigabit Ethernet Controller	31
1.12.2 RJ-45 LAN Connector with Integrated LEDs	31
1.12.3 Alert Standard Format (ASF) Support (Optional)	32
1.12.4 Intel® Active Management Technology (AMT) (Optional)	32
1.12.5 LAN Subsystem Software	34
1.13 Hardware Management Subsystem	34
1.13.1 Hardware Monitoring and Fan Control ASIC	34
1.13.2 Thermal Monitoring	35
1.13.3 Fan Monitoring	36
1.13.4 Chassis Intrusion and Detection	36
1.14 Power Management	36
1.14.1 ACPI	36
1.14.2 Hardware Support	39
1.15 Trusted Platform Module (Optional)	42
2 Technical Reference	43
2.1 Memory Resources	43
2.1.1 Addressable Memory	43
2.1.2 Memory Map	45
2.2 DMA Channels	45
2.3 Fixed I/O Map	46
2.4 PCI Configuration Space Map	47
2.5 Interrupts	48
2.6 PCI Conventional Interrupt Routing Map	49
2.7 Connectors	51
2.7.1 Back Panel Connectors	51
2.7.2 Component-side Connectors	54
2.8 Jumper Block	65
2.9 Mechanical Considerations	66
2.9.1 Form Factor	66
2.9.2 I/O Shield	67
2.10 Electrical Considerations	69
2.10.1 DC Loading	69
2.10.2 Add-in Board Considerations	69
2.10.3 Fan Connector Current Capability	70
2.10.4 Power Supply Considerations	70
2.11 Thermal Considerations	71
2.12 Reliability	73
2.13 Environmental	74
2.14 Regulatory Compliance	75
2.14.1 Safety Regulations	75
2.14.2 EMC Regulations	75
2.14.3 European Union Declaration of Conformity Statement	76
2.14.4 Recycling Considerations	77
2.14.5 Product Certification Markings (Board Level)	78
3 Overview of BIOS Features	79
3.1 Introduction	79
3.2 Resource Configuration	80
3.2.1 PCI Autoconfiguration	80
3.2.2 PCI IDE Support	80
3.3 System Management BIOS (SMBIOS)	81
3.4 Legacy USB Support	81
3.5 BIOS Updates	82
3.5.1 Language Support	82
3.5.2 Custom Splash Screen	82
3.6 Boot Options	83
3.6.1 CD-ROM Boot	83
3.6.2 Network Boot	83
3.6.3 Booting Without Attached Devices	83
3.6.4 Changing the Default Boot Device During POST	83
3.7 Fast Booting Systems with Intel® Rapid BIOS Boot	84
3.7.1 Peripheral Selection and Configuration	84
3.7.2 Intel Rapid BIOS Boot	84
3.8 BIOS Security Features	85
4 Error Messages and Beep Codes	87
4.1 Speaker	87
4.2 BIOS Beep Codes	87
4.3 BIOS Error Messages	87