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Thermal Considerations

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Technical Reference 2.12 Thermal Considerations CAUTION A chassis with a maximum internal ambient temperature of 38 oC at the processor fan inlet is a requirement. Use a processor heatsink that provides omni-directional airflow (as shown in Figure 28) to maintain required airflow across the processor voltage regulator area. OM16996 Figure 28. Processor Heatsink for Omni-directional Airflow CAUTION Failure to ensure appropriate airflow may result in reduced performance of both the processor and/or voltage regulator or, in some instances, damage to the board. For a list of chassis that have been tested with Intel desktop boards please refer to the following website: http://developer.intel.com/design/motherbd/cooling.htm All responsibility for determining the adequacy of any thermal or system design remains solely with the reader. Intel makes no warranties or representations that merely following the instructions presented in this document will result in a system with adequate thermal performance. CAUTION Ensure that the ambient temperature does not exceed the board's maximum operating temperature. Failure to do so could cause components to exceed their maximum case temperature and malfunction. For information about the maximum operating temperature, see the environmental specifications in Section 2.14. 83

Section	Page
Intel® Desktop Boards D915GAV/D915GAG Technical Product Specification	1
Revision History	2
Preface	3
Intended Audience	3
What This Document Contains	3
Typographical Conventions	3
Other Common Notations	4
Contents	5
1 Product Description	11
1.1 PCI Bus Terminology Change	11
1.2 Board Differences	11
1.3 Overview	12
1.3.1 Feature Summary	12
1.3.2 Manufacturing Options	13
1.3.3 Board Layouts	14
1.3.4 Block Diagram	18
1.4 Online Support	19
1.5 Processor	19
1.6 System Memory	20
1.6.1 Memory Configurations	22
1.7 Intel® 915G Chipset	26
1.7.1 Intel 915G Graphics Subsystem	26
1.7.2 USB	28
1.7.3 IDE Support	28
1.7.4 Real-Time Clock, CMOS SRAM, and Battery	30
1.8 PCI Express Connectors	30
1.9 I/O Controller	31
1.9.1 Serial Ports	31
1.9.2 Parallel Port	31
1.9.3 Diskette Drive Controller	32
1.9.4 Keyboard and Mouse Interface	32
1.10 Audio Subsystem	32
1.10.1 Audio Subsystem Software	33
1.10.2 Audio Connectors	33
1.10.3 Intel High Definition Audio Subsystem	34
1.11 LAN Subsystem	35
1.11.1 10/100 Mbits/sec LAN Subsystem	35
1.11.2 Gigabit LAN Subsystem	36
1.11.3 Alert Standard Format (ASF) Support	37
1.11.4 LAN Subsystem Software	38
1.12 Hardware Management Subsystem	38
1.12.1 Hardware Monitoring and Fan Control ASIC	38
1.12.2 Thermal Monitoring	39
1.12.3 Fan Monitoring	41
1.12.4 Chassis Intrusion and Detection	41
1.13 Power Management	41
1.13.1 ACPI	41
1.13.2 Hardware Support	44
1.14 Trusted Platform Module (Optional)	48
1.14.1 System Requirements	48
1.14.2 Warning of Potential Data Loss	48
1.14.3 Security Precautions	49
1.14.4 Trusted Platform Module Ownership	50
1.14.5 Enabling the Trusted Platform Module	51
1.14.6 Assuming Trusted Platform Module Ownership	51
1.14.7 Recovery Procedures	52
1.14.8 Clearing Trusted Platform Module Ownership	53
1.14.9 Software Support	54
2 Technical Reference	55
2.1 Introduction	55
2.2 Memory Resources	55
2.2.1 Addressable Memory	55
2.2.2 Memory Map	57
2.3 DMA Channels	57
2.4 Fixed I/O Map	58
2.5 PCI Configuration Space Map	59
2.6 Interrupts	60
2.7 PCI Conventional Interrupt Routing Map	61
2.8 Connectors	63
2.8.1 Back Panel Connectors	64
2.8.2 Component-side Connectors	66
2.9 Jumper Block	77
2.10 Mechanical Considerations	78
2.10.1 D915GAV Board Form Factor	78
2.10.2 D915GAG Board Form Factor	79
2.10.3 I/O Shield	80
2.11 Electrical Considerations	81
2.11.1 DC Loading	81
2.11.2 Add-in Board Considerations	81
2.11.3 Fan Connector Current Capability	82
2.11.4 Power Supply Considerations	82
2.12 Thermal Considerations	83
2.13 Reliability	85
2.14 Environmental	86
2.15 Regulatory Compliance	87
2.15.1 Safety Regulations	87
2.15.2 EMC Regulations	87
2.15.3 European Union Declaration of Conformity Statement	88
2.15.4 Product Ecology Statements	89
2.15.5 Product Certification Markings (Board Level)	90
3 Overview of BIOS Features	91
3.1 Introduction	91
3.2 BIOS Flash Memory Organization	92
3.3 Resource Configuration	92
3.3.1 PCI Autoconfiguration	92
3.3.2 PCI IDE Support	92
3.4 System Management BIOS (SMBIOS)	93
3.5 Legacy USB Support	93
3.6 BIOS Updates	94
3.6.1 Language Support	94
3.6.2 Custom Splash Screen	94
3.7 Boot Options	95
3.7.1 CD-ROM Boot	95
3.7.2 Network Boot	95
3.7.3 Booting Without Attached Devices	95
3.7.4 Changing the Default Boot Device During POST	95
3.8 Fast Booting Systems with Intel Rapid BIOS Boot	96
3.8.1 Peripheral Selection and Configuration	96
3.8.2 Intel Rapid BIOS Boot	96
3.9 BIOS Security Features	97
4 Error Messages and Beep Codes	99
4.1 BIOS Error Messages	99
4.2 Port 80h POST Codes	101
4.3 Bus Initialization Checkpoints	105
4.4 Speaker	106

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Technical Reference

2.12

Thermal Considerations

CAUTION

A chassis with a maximum internal ambient temperature of 38

C at the processor fan inlet is a

requirement.

Use a processor heatsink that provides omni-directional airflow (as shown in

Figure 28) to maintain required airflow across the processor voltage regulator area.

OM16996

Figure 28.

Processor Heatsink for Omni-directional Airflow

CAUTION

Failure to ensure appropriate airflow may result in reduced performance of both the processor

and/or voltage regulator or, in some instances, damage to the board.

For a list of chassis that have

been tested with Intel desktop boards please refer to the following website:

http://developer.intel.com/design/motherbd/cooling.htm

All responsibility for determining the adequacy of any thermal or system design remains solely with

the reader.

Intel makes no warranties or representations that merely following the instructions

presented in this document will result in a system with adequate thermal performance.

CAUTION

Ensure that the ambient temperature does not exceed the board’s maximum operating temperature.

Failure to do so could cause components to exceed their maximum case temperature and

malfunction.

For information about the maximum operating temperature, see the environmental

specifications in Section 2.14.