Intel D925XECV2 Product Specification - Page 89

Reliability - pentium d

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Technical Reference Table 39 provides maximum case temperatures for the Desktop Board D925XECV2/D925XEBC2 components that are sensitive to thermal changes. The operating temperature, current load, or operating frequency could affect case temperatures. Maximum case temperatures are important when considering proper airflow to cool the Desktop Board D925XECV2/D925XEBC2. Table 39. Thermal Considerations for Components Component Intel Pentium 4 processor Intel 82925XE MCH Intel 82801FR ICH6-R Maximum Case Temperature For processor case temperature, see processor datasheets and processor specification updates 99 oC (under bias) 110 oC (under bias) For information about Intel Pentium 4 processor datasheets and specification updates Refer to Section 1.4, page 19 2.13 Reliability The Mean Time Between Failures (MTBF) prediction is calculated using component and subassembly random failure rates. The calculation is based on the Bellcore Reliability Prediction Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF prediction is used to estimate repair rates and spare parts requirements. The MTBF data is calculated from predicted data at 55 ºC. The MTBF for the D925XECV2 and D925XEBC2 boards is 105,577 hours. 89

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Technical Reference
89
Table 39 provides maximum case temperatures for the Desktop Board D925XECV2/D925XEBC2
components that are sensitive to thermal changes.
The operating temperature, current load, or
operating frequency could affect case temperatures.
Maximum case temperatures are important
when considering proper airflow to cool the Desktop Board D925XECV2/D925XEBC2.
Table 39.
Thermal Considerations for Components
Component
Maximum Case Temperature
Intel Pentium 4 processor
For processor case temperature, see processor datasheets and
processor specification updates
Intel
82925XE MCH
99
o
C (under bias)
Intel 82801FR ICH6-R
110
o
C (under bias)
For information about
Refer to
Intel Pentium 4 processor datasheets and specification updates
Section 1.4, page 19
2.13 Reliability
The Mean Time Between Failures (MTBF) prediction is calculated using component and
subassembly random failure rates.
The calculation is based on the Bellcore Reliability Prediction
Procedure, TR-NWT-000332, Issue 4, September 1991.
The MTBF prediction is used to estimate
repair rates and spare parts requirements.
The MTBF data is calculated from predicted data at 55 ºC.
The MTBF for the D925XECV2 and
D925XEBC2 boards is 105,577 hours.