Intel MFS2600KI Technical Product Specification - Page 13

System Overview

Intel® Modular Server System TPS

6

Revision 1.7

Intel order number E15155-010

2.2.1

Compute Module

The Intel

®

Modular Server System MFSYS25/MFSYS35 supports up to six compute modules.

Each of these general-purpose servers provides the following minimum features:

±

Processor(s)

±

Memory

±

Integrated Baseboard management controller

±

Network interface

Each server connects to the chassis management module, storage controllers and switch

modules through the midplane board. The midplane also distributes the 12V power from the

power supplies to the compute modules. The servers connect to the shared storage (14 SAS

drives in the Intel

®

Modular Server System MFSYS25 and six SAS/SATA drives in the Intel

®

Modular Server System MFSYS35) through the storage controller(s) in the rear of the chassis.

See the individual Intel

®

Compute Module

Technical Product Specification

for model-specific

information about your compute module(s).

2.2.2

Storage Enclosure

The

Intel

®

Modular Server System MFSYS25/MFSYS35 supports

an optional hard disk drive

storage enclosure and has the following minimum features:

±

Bays for 14 hot-swap 2.5-inch SAS hard disk drives in the Intel

®

Modular Server System

MFSYS25 and six (6) 3.5-inch SAS/SATA hard drives in the Intel

®

Modular Server

System MFSYS35

±

At least one storage controller in an I/O slot

Because hard disk drives have different cooling, power, and vibration characteristics, Intel

validates specific hard disk drive types in the platforms. See the

Intel

®

Modular Server System

Tested Hardware and Operating System List

for a list of qualified drives.

2.2.3

I/O Cooling Module

The I/O cooling module consists of six fans that operate in a (3 + 3) cooling redundancy in a

hot-swap module with power and failure indicators. These fans provide cooling for all I/O

modules. This module is accessible from the front of the system even though it cools the I/O

modules in the rear of the system.

Section	Page
Title Page	1
Revision History	2
Table of Contents	3
List of Figures	5
List of Tables	6
1. Product Overview	8
2. System Overview	9
2.1 Introduction	9
2.2 External Chassis Features – Front	12
2.2.1 Compute Module	13
2.2.2 Storage Enclosure	13
2.2.3 I/O Cooling Module	13
2.3 External Chassis Features – Rear	14
2.3.1 Power Supply Module	14
2.3.2 I/O Slots	14
2.3.2.1 Ethernet Switch Module	14
2.3.2.2 Storage Controller Module	15
2.3.3 Chassis Management Module	15
2.3.4 Main Cooling Module	15
2.4 Internal Chassis Features	15
2.4.1 Midplane Board	17
2.4.2 Storage Interposer Board	18
2.5 Mounting and Service Features	18
2.5.1 Chassis	18
2.5.2 Rails	18
2.6 Server Management	18
2.6.1 Chassis Management Module	19
2.6.2 Compute Module Management	19
2.7 Reliability, Availability, Serviceability, Usability, Manageability (RASUM)	20
3. System Details	21
3.1 Specifications	21
3.1.1 Environmental Specifications Summary	21
3.1.2 Physical Specifications Summary	21
3.1.3 Power Specifications Summary	22
3.2 Chassis	23
3.3 Midplane Board	26
3.3.1 Mechanical Outline	26
3.3.2 3D Renderings	27
3.4 Compute Module	28
3.4.1 Introduction	28
3.4.2 Drawings	29
3.5 Chassis Management Module	29
3.5.1 Introduction	29
3.5.1.1 CMM	29
3.5.1.2 CMM2	29
3.5.2 Mechanical Outline	31
3.5.3 Block Diagram	32
3.5.3.1 CMM	32
3.5.3.2 CMM2	32
3.5.4 Drawings	33
3.5.5 Architectural Overview	33
3.6 Ethernet Switch Module	34
3.6.1 Introduction	34
3.6.2 Mechanical Outline	35
3.6.3 Block Diagram	36
3.6.4 Architectural Overview	36
3.7 Storage Controller Module	37
3.7.1 Storage Subsystem Introduction	37
3.7.2 Mechanical Outline	37
3.7.3 Storage Controller Module View	38
3.7.4 Architectural Overview	38
3.7.4.1 Storage Controller Module Interface	38
3.7.4.2 Interposer Card Functionality	38
3.7.4.3 Drive Backplane Interface	39
3.8 Power Supply Module	39
3.9 Jumpers and LEDs	40
4. Product Regulatory Requirements	41
4.1 Product Regulatory Compliance	41
4.1.1 Product Safety Compliance	41
4.1.2 Product EMC Compliance - Class A Compliance	41
4.1.3 Product Ecology Compliance	41
4.1.4 Certifications/Registrations/Declarations	42
4.2 Product Regulatory Compliance Markings	42
4.3 Regulated Specified Components	47
4.4 Electromagnetic Compatibility Notices	48
4.4.1 FCC Verification Statement (USA)	48
4.4.2 ICES-003 (Canada)	49
4.4.3 Europe (CE Declaration of Conformity)	49
4.4.4 VCCI (Japan)	50
4.4.5 BSMI (Taiwan)	50
Glossary	52

Intel MFS2600KI Technical Product Specification - Page 13

Compute Module, Storage Enclosure, I/O Cooling Module - processors

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