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Intel MFS2600KI Technical Product Specification - Page 23

Chassis

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System Details Intel® Modular Server System TPS 3.2 Chassis The Intel® Modular Server System MFSYS25/MFSYS35 design accommodates multiple generations of compute modules, I/O modules, and storage controllers without the need to upgrade or modify the chassis or the midplane board. This strategy allows the system to be in use for many years with only the occasional upgrade of front and/or rear components as new technologies become available. The following two figures show the front view of an empty Intel® Modular Server System MFSYS25/MFSYS35. Note that the hard drive bay is installed and the hard drive backplane is visible on the left side of the chassis. The midplane board is also installed and is visible through the empty compute module bay area. HDD Backplane Midplane Figure 8. Front View of Empty Intel® Modular Server System MFSYS25 16 Revision 1.7 Intel order number E15155-010

Section	Page
Title Page	1
Revision History	2
Table of Contents	3
List of Figures	5
List of Tables	6
1. Product Overview	8
2. System Overview	9
2.1 Introduction	9
2.2 External Chassis Features – Front	12
2.2.1 Compute Module	13
2.2.2 Storage Enclosure	13
2.2.3 I/O Cooling Module	13
2.3 External Chassis Features – Rear	14
2.3.1 Power Supply Module	14
2.3.2 I/O Slots	14
2.3.2.1 Ethernet Switch Module	14
2.3.2.2 Storage Controller Module	15
2.3.3 Chassis Management Module	15
2.3.4 Main Cooling Module	15
2.4 Internal Chassis Features	15
2.4.1 Midplane Board	17
2.4.2 Storage Interposer Board	18
2.5 Mounting and Service Features	18
2.5.1 Chassis	18
2.5.2 Rails	18
2.6 Server Management	18
2.6.1 Chassis Management Module	19
2.6.2 Compute Module Management	19
2.7 Reliability, Availability, Serviceability, Usability, Manageability (RASUM)	20
3. System Details	21
3.1 Specifications	21
3.1.1 Environmental Specifications Summary	21
3.1.2 Physical Specifications Summary	21
3.1.3 Power Specifications Summary	22
3.2 Chassis	23
3.3 Midplane Board	26
3.3.1 Mechanical Outline	26
3.3.2 3D Renderings	27
3.4 Compute Module	28
3.4.1 Introduction	28
3.4.2 Drawings	29
3.5 Chassis Management Module	29
3.5.1 Introduction	29
3.5.1.1 CMM	29
3.5.1.2 CMM2	29
3.5.2 Mechanical Outline	31
3.5.3 Block Diagram	32
3.5.3.1 CMM	32
3.5.3.2 CMM2	32
3.5.4 Drawings	33
3.5.5 Architectural Overview	33
3.6 Ethernet Switch Module	34
3.6.1 Introduction	34
3.6.2 Mechanical Outline	35
3.6.3 Block Diagram	36
3.6.4 Architectural Overview	36
3.7 Storage Controller Module	37
3.7.1 Storage Subsystem Introduction	37
3.7.2 Mechanical Outline	37
3.7.3 Storage Controller Module View	38
3.7.4 Architectural Overview	38
3.7.4.1 Storage Controller Module Interface	38
3.7.4.2 Interposer Card Functionality	38
3.7.4.3 Drive Backplane Interface	39
3.8 Power Supply Module	39
3.9 Jumpers and LEDs	40
4. Product Regulatory Requirements	41
4.1 Product Regulatory Compliance	41
4.1.1 Product Safety Compliance	41
4.1.2 Product EMC Compliance - Class A Compliance	41
4.1.3 Product Ecology Compliance	41
4.1.4 Certifications/Registrations/Declarations	42
4.2 Product Regulatory Compliance Markings	42
4.3 Regulated Specified Components	47
4.4 Electromagnetic Compatibility Notices	48
4.4.1 FCC Verification Statement (USA)	48
4.4.2 ICES-003 (Canada)	49
4.4.3 Europe (CE Declaration of Conformity)	49
4.4.4 VCCI (Japan)	50
4.4.5 BSMI (Taiwan)	50
Glossary	52