Intel MFS2600KI Technical Product Specification - Page 39

System Details

Intel® Modular Server System TPS

32

Revision 1.7

Intel order number E15155-010

12 V bulk power is provided by the midplane. The Interposer has a power converter function for

internal needs, and also supplies the disk drive power (12 V boost may be required).

The VPD SEEPROM contains a WW (World Wide) unique address which the SCM uses to

derive a SAS WWN (World Wide Name). It also contains manufacturing data, such as serial and

version numbers for the Interposer.

Hardware monitoring on the Interposer includes a temperature sensor. The data is passed back

to the SCM through expander SES pages.

Disk drive status LEDs are driven by expander GPIO signals, and collaboration logic must be

present on the Interposer since either SCM (and either expander) can drive the status LEDs.

3.7.4.3

Drive Backplane Interface

The Interposer converts bulk 12 V from the midplane to provide +5 V and +12 V for disk drive

power. Sufficient current is supplied for sequenced spin-up of drives in groups of 4-4-2-2-2 (for

2.5-inch configurations). Supported drive types include 15K RPM SAS drives.

Signals are provided for single-color status LEDs for each disk drive.

An expander sourced I²C bus is connected to the drive backplane IDROM.

Expanders send appropriate command/signal to an optional SATA active/active MUX dongle

card on disk drive carriers to control 5 V and 12 V power.

3.8

Power Supply Module

The power supply module in Intel

®

Modular Server System MFSYS25/MFSYS35 is a 1000-W

DC output supply with 110-240V AC input. Each power supply includes two fans that provide

cooling for optional hot-swap disk drives.

The power subsystem is configured as follows:

±

With four power supply modules installed, a fully configured system has (3+1) power

redundancy.

±

With three power supply modules installed, a fully configured system would not have

redundant power.

Three power supply modules are capable of handling the maximum power requirements for fully

configured platforms, which includes six compute modules, two storage controllers, two

Ethernet switch modules, one chassis management module, and fourteen hot-swap 2.5-inch

hard disk drives or six hot-swap 3.5-inch hard disk drives.

When four power supply modules are installed, the user can replace a failed power supply

module without affecting system functionality. Power supplies have two LEDs to identify failure,

power good and AC OK.

The power subsystem receives AC power through four power cords.

Section	Page
Title Page	1
Revision History	2
Table of Contents	3
List of Figures	5
List of Tables	6
1. Product Overview	8
2. System Overview	9
2.1 Introduction	9
2.2 External Chassis Features – Front	12
2.2.1 Compute Module	13
2.2.2 Storage Enclosure	13
2.2.3 I/O Cooling Module	13
2.3 External Chassis Features – Rear	14
2.3.1 Power Supply Module	14
2.3.2 I/O Slots	14
2.3.2.1 Ethernet Switch Module	14
2.3.2.2 Storage Controller Module	15
2.3.3 Chassis Management Module	15
2.3.4 Main Cooling Module	15
2.4 Internal Chassis Features	15
2.4.1 Midplane Board	17
2.4.2 Storage Interposer Board	18
2.5 Mounting and Service Features	18
2.5.1 Chassis	18
2.5.2 Rails	18
2.6 Server Management	18
2.6.1 Chassis Management Module	19
2.6.2 Compute Module Management	19
2.7 Reliability, Availability, Serviceability, Usability, Manageability (RASUM)	20
3. System Details	21
3.1 Specifications	21
3.1.1 Environmental Specifications Summary	21
3.1.2 Physical Specifications Summary	21
3.1.3 Power Specifications Summary	22
3.2 Chassis	23
3.3 Midplane Board	26
3.3.1 Mechanical Outline	26
3.3.2 3D Renderings	27
3.4 Compute Module	28
3.4.1 Introduction	28
3.4.2 Drawings	29
3.5 Chassis Management Module	29
3.5.1 Introduction	29
3.5.1.1 CMM	29
3.5.1.2 CMM2	29
3.5.2 Mechanical Outline	31
3.5.3 Block Diagram	32
3.5.3.1 CMM	32
3.5.3.2 CMM2	32
3.5.4 Drawings	33
3.5.5 Architectural Overview	33
3.6 Ethernet Switch Module	34
3.6.1 Introduction	34
3.6.2 Mechanical Outline	35
3.6.3 Block Diagram	36
3.6.4 Architectural Overview	36
3.7 Storage Controller Module	37
3.7.1 Storage Subsystem Introduction	37
3.7.2 Mechanical Outline	37
3.7.3 Storage Controller Module View	38
3.7.4 Architectural Overview	38
3.7.4.1 Storage Controller Module Interface	38
3.7.4.2 Interposer Card Functionality	38
3.7.4.3 Drive Backplane Interface	39
3.8 Power Supply Module	39
3.9 Jumpers and LEDs	40
4. Product Regulatory Requirements	41
4.1 Product Regulatory Compliance	41
4.1.1 Product Safety Compliance	41
4.1.2 Product EMC Compliance - Class A Compliance	41
4.1.3 Product Ecology Compliance	41
4.1.4 Certifications/Registrations/Declarations	42
4.2 Product Regulatory Compliance Markings	42
4.3 Regulated Specified Components	47
4.4 Electromagnetic Compatibility Notices	48
4.4.1 FCC Verification Statement (USA)	48
4.4.2 ICES-003 (Canada)	49
4.4.3 Europe (CE Declaration of Conformity)	49
4.4.4 VCCI (Japan)	50
4.4.5 BSMI (Taiwan)	50
Glossary	52

Intel MFS2600KI Technical Product Specification - Page 39

Power Supply Module

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