Intel MFS2600KI Technical Product Specification - Page 22

Power Specifications Summary

Page 22 highlights

Intel® Modular Server System TPS System Details Table 4. Physical Dimensions of Hardware Components Module Chassis Compute module CMM I/O Storage Hard drive bay Power supply module Main cooling module I/O cooling module Height 261.4 mm 41.7 mm 25.0 mm 38.0 mm 32.0 mm 182.5 mm 53.3 mm 126.6 mm 49.4 mm Width 444.4 mm 279.4 mm 167.6 mm 167.6 mm 167.6 mm 130.2 mm 115 mm 126.0 mm 132.6 mm Length 720.2 mm 420.3 mm 295.9 mm 295.9 mm 295.9 mm 419.1 mm 286.3 mm 291.9 mm 416.9 mm 3.1.3 Power Specifications Summary The following table provides a summary of the 12V power budget for all modules in the Intel® Modular Server System MFSYS25/MFSYS35. Table 5. Power Budget of Hardware Components Subsystem Compute module Mezzanine card Chassis management module Chassis management module 2 I/O Switch Storage module 2.5/3.5-inch SAS drives Chassis Power supply blank 12V Budget 406 W 5 W 5 W 24 W 40 W 48 W 140 W 188 W 26 W The following table provides a summary of the power and heat dissipation specifications for the Intel® Modular Server System MFSYS25/MFSYS35. Table 6. Power and Heat Dissipation Specifications of Chassis Power Supply Input Power Supply Output System Power Input System Power Output System Power System Heat Dissipation System Heat Dissipation 1240 W 1050 W 3720 W 3150 W 100 V - 127 V, 200 V - 240 V 3720 W (12,701 BTUH) maximum 428 W (1461 BTUH) minimum Revision 1.7 15 Intel order number E15155-010

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Intel® Modular Server System TPS
System Details
Revision 1.7
Intel order number E15155-010
15
Table 4. Physical Dimensions of Hardware Components
Module
Height
Width
Length
Chassis
261.4 mm
444.4 mm
720.2 mm
Compute module
41.7 mm
279.4 mm
420.3 mm
CMM
25.0 mm
167.6 mm
295.9 mm
I/O
38.0 mm
167.6 mm
295.9 mm
Storage
32.0 mm
167.6 mm
295.9 mm
Hard drive bay
182.5 mm
130.2 mm
419.1 mm
Power supply
module
53.3 mm
115 mm
286.3 mm
Main cooling module
126.6 mm
126.0 mm
291.9 mm
I/O cooling module
49.4 mm
132.6 mm
416.9 mm
3.1.3
Power Specifications Summary
The following table provides a summary of the 12V power budget for all modules in the Intel
®
Modular Server System MFSYS25/MFSYS35
.
Table 5. Power Budget of Hardware Components
Subsystem
12V Budget
Compute module
406 W
Mezzanine card
5 W
Chassis management module
5 W
Chassis management module 2
24 W
I/O Switch
40 W
Storage module
48 W
2.5/3.5-inch SAS drives
140 W
Chassis
188 W
Power supply blank
26 W
The following table provides a summary of the power and heat dissipation specifications for the
Intel
®
Modular Server System MFSYS25/MFSYS35.
Table 6. Power and Heat Dissipation Specifications of Chassis
Power Supply Input
1240 W
Power Supply Output
1050 W
System Power Input
3720 W
System Power Output
3150 W
System Power
100 V – 127 V, 200 V – 240 V
System Heat Dissipation
3720 W (12,701 BTUH) maximum
System Heat Dissipation
428 W (1461 BTUH) minimum