Intel MFS2600KI Technical Product Specification - Page 8

Intel® Modular Server System TPS

Product Overview

Revision 1.7

Intel order number E15155-010

1

1.

Product Overview

This product specification details the features of the Intel

®

Modular Server System. This product

is designed to serve the small to medium business environment. Primary design considerations

include ease of use, reliability, low cost, modularity, and remote management.

The following three versions of the Intel

®

Modular Server System are available:

±

Intel

®

Modular Server System MFSYS25

±

Intel

®

Modular Server System MFSYS25V2

±

Intel

®

Modular Server System MFSYS35

Note:

All references in the document to MFSYS25 are for both MFSYS25 and MFSYS25V2.

Exceptions will call out either MFSYS25 or MFSYS25V2.

The Intel

®

Modular Server System MFSYS25/MFSYS35 supports up to six dual-processor

compute modules, or a total of 12 Multi-Core Intel

®

Xeon

®

5000 sequence processors. The

chassis also incorporates features that clearly distinguish it as an easy-to-use and highly

available server platform. Building on previous server platforms, the Intel

®

Modular Server

System MFSYS25/MFSYS35 includes redundant storage and networking, in addition to the

enterprise features of hot-swap power, cooling, and hard disk drives. Advanced server

management features remotely monitor and manage the server.

This document is organized into four sections:

±

Section 1: Product Overview

This section provides an overview of the product.

±

Section 2: System Overview

This section provides an overview of the system hardware.

±

Section 3: System Details

This section provides details of the various hardware components specific to the

server platform.

±

Section 4: Product Regulatory Requirements

This section describes system compliance to regulatory specifications.

Section	Page
Title Page	1
Revision History	2
Table of Contents	3
List of Figures	5
List of Tables	6
1. Product Overview	8
2. System Overview	9
2.1 Introduction	9
2.2 External Chassis Features – Front	12
2.2.1 Compute Module	13
2.2.2 Storage Enclosure	13
2.2.3 I/O Cooling Module	13
2.3 External Chassis Features – Rear	14
2.3.1 Power Supply Module	14
2.3.2 I/O Slots	14
2.3.2.1 Ethernet Switch Module	14
2.3.2.2 Storage Controller Module	15
2.3.3 Chassis Management Module	15
2.3.4 Main Cooling Module	15
2.4 Internal Chassis Features	15
2.4.1 Midplane Board	17
2.4.2 Storage Interposer Board	18
2.5 Mounting and Service Features	18
2.5.1 Chassis	18
2.5.2 Rails	18
2.6 Server Management	18
2.6.1 Chassis Management Module	19
2.6.2 Compute Module Management	19
2.7 Reliability, Availability, Serviceability, Usability, Manageability (RASUM)	20
3. System Details	21
3.1 Specifications	21
3.1.1 Environmental Specifications Summary	21
3.1.2 Physical Specifications Summary	21
3.1.3 Power Specifications Summary	22
3.2 Chassis	23
3.3 Midplane Board	26
3.3.1 Mechanical Outline	26
3.3.2 3D Renderings	27
3.4 Compute Module	28
3.4.1 Introduction	28
3.4.2 Drawings	29
3.5 Chassis Management Module	29
3.5.1 Introduction	29
3.5.1.1 CMM	29
3.5.1.2 CMM2	29
3.5.2 Mechanical Outline	31
3.5.3 Block Diagram	32
3.5.3.1 CMM	32
3.5.3.2 CMM2	32
3.5.4 Drawings	33
3.5.5 Architectural Overview	33
3.6 Ethernet Switch Module	34
3.6.1 Introduction	34
3.6.2 Mechanical Outline	35
3.6.3 Block Diagram	36
3.6.4 Architectural Overview	36
3.7 Storage Controller Module	37
3.7.1 Storage Subsystem Introduction	37
3.7.2 Mechanical Outline	37
3.7.3 Storage Controller Module View	38
3.7.4 Architectural Overview	38
3.7.4.1 Storage Controller Module Interface	38
3.7.4.2 Interposer Card Functionality	38
3.7.4.3 Drive Backplane Interface	39
3.8 Power Supply Module	39
3.9 Jumpers and LEDs	40
4. Product Regulatory Requirements	41
4.1 Product Regulatory Compliance	41
4.1.1 Product Safety Compliance	41
4.1.2 Product EMC Compliance - Class A Compliance	41
4.1.3 Product Ecology Compliance	41
4.1.4 Certifications/Registrations/Declarations	42
4.2 Product Regulatory Compliance Markings	42
4.3 Regulated Specified Components	47
4.4 Electromagnetic Compatibility Notices	48
4.4.1 FCC Verification Statement (USA)	48
4.4.2 ICES-003 (Canada)	49
4.4.3 Europe (CE Declaration of Conformity)	49
4.4.4 VCCI (Japan)	50
4.4.5 BSMI (Taiwan)	50
Glossary	52

Intel MFS2600KI Technical Product Specification - Page 8

Product Overview - support

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