Intel MFS2600KI Technical Product Specification - Page 21

System Details

Intel® Modular Server System TPS

14

Revision 1.7

Intel order number E15155-010

3.

System Details

3.1

Specifications

3.1.1

Environmental Specifications Summary

The following table describes the environmental specifications of the Intel

®

Modular Server

System MFSYS25/MFSYS35

Table 2. Environmental Specifications Summary

Environment

Specification

Temperature operating

10°C to 35°C

50°F to 95°F

Temperature non-operating

-40°C to 70°C

-40°F to 158°F

Altitude

-30 to 1,500 m

-100 to 5,000 ft

Humidity non-operating

95%, non-condensing at temperatures of 25°C (77°F) to 30°C (86°F)

Vibration non-operating

2.2 g, 10 minutes per axis on each of the three axes

Shock operating

Half-sine 2 G, 11 ms pulse, 100 pulses in each direction, on each of the three axes

Shock non-operating

Trapezoidal, 25 G, two drops on each of six faces

V : 175 inches/sec on bottom face drop, 90 inches/sec on other 5 faces

Safety

UL60 950, CSA60 950, AS/NZS 3562, GB4943-1995, EN60 950

and

73/23/EEC, IEC 60

950, EMKO-TSE (74-SEC) 207/94, GOST-R 50377-92

Emissions

Certified to FCC Class A; tested to CISPR 22 Class A, EN 55022 Class A

and

89/336/EEC, VCCI Class A, AS/NZS 3548 Class A, ICES-003 Class A, GB9254-1998,

MIC Notice 1997-42 Class A, GOST-R 29216-91 Class A, BSMI CNS13438

Immunity

Verified to comply with EN55024, CISPR 24, GB9254-1998, MIC Notice 1997-41,

GOST-R 50628-95

Electrostatic discharge

Tested to ESD levels up to 15 kilovolts (kV) air discharge and up to 8 kV contact

discharge without physical damage

Acoustic

Sound power: < 7.0 BA at ambient temperature < 23° C measured using the Dome

Method

GOST MsanPiN 001-96

3.1.2

Physical Specifications Summary

The following table describes the physical specifications of the Intel

®

Modular Server System

MFSYS25/MFSYS35.

Table 3. Physical Specifications of Chassis

Specification

Value

Height – 6U

10.3 inches

261.4 mm

Width

17.5 inches

444.4 mm

Depth

28.4 inches

720.2 mm

Weight (full configuration)

187 lbs

85 kg

The following table describes the physical dimensions of the Intel

®

Modular Server System

MFSYS25/MFSYS35

and all components.

Section	Page
Title Page	1
Revision History	2
Table of Contents	3
List of Figures	5
List of Tables	6
1. Product Overview	8
2. System Overview	9
2.1 Introduction	9
2.2 External Chassis Features – Front	12
2.2.1 Compute Module	13
2.2.2 Storage Enclosure	13
2.2.3 I/O Cooling Module	13
2.3 External Chassis Features – Rear	14
2.3.1 Power Supply Module	14
2.3.2 I/O Slots	14
2.3.2.1 Ethernet Switch Module	14
2.3.2.2 Storage Controller Module	15
2.3.3 Chassis Management Module	15
2.3.4 Main Cooling Module	15
2.4 Internal Chassis Features	15
2.4.1 Midplane Board	17
2.4.2 Storage Interposer Board	18
2.5 Mounting and Service Features	18
2.5.1 Chassis	18
2.5.2 Rails	18
2.6 Server Management	18
2.6.1 Chassis Management Module	19
2.6.2 Compute Module Management	19
2.7 Reliability, Availability, Serviceability, Usability, Manageability (RASUM)	20
3. System Details	21
3.1 Specifications	21
3.1.1 Environmental Specifications Summary	21
3.1.2 Physical Specifications Summary	21
3.1.3 Power Specifications Summary	22
3.2 Chassis	23
3.3 Midplane Board	26
3.3.1 Mechanical Outline	26
3.3.2 3D Renderings	27
3.4 Compute Module	28
3.4.1 Introduction	28
3.4.2 Drawings	29
3.5 Chassis Management Module	29
3.5.1 Introduction	29
3.5.1.1 CMM	29
3.5.1.2 CMM2	29
3.5.2 Mechanical Outline	31
3.5.3 Block Diagram	32
3.5.3.1 CMM	32
3.5.3.2 CMM2	32
3.5.4 Drawings	33
3.5.5 Architectural Overview	33
3.6 Ethernet Switch Module	34
3.6.1 Introduction	34
3.6.2 Mechanical Outline	35
3.6.3 Block Diagram	36
3.6.4 Architectural Overview	36
3.7 Storage Controller Module	37
3.7.1 Storage Subsystem Introduction	37
3.7.2 Mechanical Outline	37
3.7.3 Storage Controller Module View	38
3.7.4 Architectural Overview	38
3.7.4.1 Storage Controller Module Interface	38
3.7.4.2 Interposer Card Functionality	38
3.7.4.3 Drive Backplane Interface	39
3.8 Power Supply Module	39
3.9 Jumpers and LEDs	40
4. Product Regulatory Requirements	41
4.1 Product Regulatory Compliance	41
4.1.1 Product Safety Compliance	41
4.1.2 Product EMC Compliance - Class A Compliance	41
4.1.3 Product Ecology Compliance	41
4.1.4 Certifications/Registrations/Declarations	42
4.2 Product Regulatory Compliance Markings	42
4.3 Regulated Specified Components	47
4.4 Electromagnetic Compatibility Notices	48
4.4.1 FCC Verification Statement (USA)	48
4.4.2 ICES-003 (Canada)	49
4.4.3 Europe (CE Declaration of Conformity)	49
4.4.4 VCCI (Japan)	50
4.4.5 BSMI (Taiwan)	50
Glossary	52

Intel MFS2600KI Technical Product Specification - Page 21

System Details

Page 21 highlights