Intel MFS2600KI Technical Product Specification - Page 29

System Details

Intel® Modular Server System TPS

22

Revision 1.7

Intel order number E15155-010

3.4.2

Drawings

This section contains perspective views of the compute module.

The following figure shows the front view of the module.

Figure 15. Front View of Compute Module

3.5

Chassis Management Module

This section describes the chassis management module (CMM) in the Intel

®

Modular Server

System MFSYS25/MFSYS35.

3.5.1

Introduction

3.5.1.1

CMM

The server platform’s chassis management module (CMM) provides chassis-wide system

management. It interfaces with all system components either through the I

2

C bus or through the

Intel

®

Ethernet Switch Module. (The CMM connects through the Ethernet directly to the storage

controller module(s) and the Intel

®

Ethernet Switch Module(s), and indirectly to the compute

modules. There are no Ethernet connections to the power supply modules, cooling modules, or

LED boards.) The main components of the CMM are the IXP-425 microcontroller, which runs

the Linux OS in addition to the built-in server control GUI, and the FPGA, which provides I²C

bus expansion among other functionality.

3.5.1.2

CMM2

The server platform’s chassis management module 2 (CMM2) provides chassis-wide system

management. It interfaces with all system components either through the I

2

C bus or through the

Intel

®

Ethernet Switch Module. (The CMM2 connects through the Ethernet directly to the

storage controller module(s) and the Intel

®

Ethernet Switch Module(s), and indirectly to the

compute modules. There are no Ethernet connections to the power supply modules, cooling

modules, or LED boards.) The main components of the CMM2 are the Intel

®

EP80579

Integrated Processor, which runs the Linux OS in addition to the built-in server control GUI, and

the FPGA, which provides I²C bus expansion among other functionality.

Section	Page
Title Page	1
Revision History	2
Table of Contents	3
List of Figures	5
List of Tables	6
1. Product Overview	8
2. System Overview	9
2.1 Introduction	9
2.2 External Chassis Features – Front	12
2.2.1 Compute Module	13
2.2.2 Storage Enclosure	13
2.2.3 I/O Cooling Module	13
2.3 External Chassis Features – Rear	14
2.3.1 Power Supply Module	14
2.3.2 I/O Slots	14
2.3.2.1 Ethernet Switch Module	14
2.3.2.2 Storage Controller Module	15
2.3.3 Chassis Management Module	15
2.3.4 Main Cooling Module	15
2.4 Internal Chassis Features	15
2.4.1 Midplane Board	17
2.4.2 Storage Interposer Board	18
2.5 Mounting and Service Features	18
2.5.1 Chassis	18
2.5.2 Rails	18
2.6 Server Management	18
2.6.1 Chassis Management Module	19
2.6.2 Compute Module Management	19
2.7 Reliability, Availability, Serviceability, Usability, Manageability (RASUM)	20
3. System Details	21
3.1 Specifications	21
3.1.1 Environmental Specifications Summary	21
3.1.2 Physical Specifications Summary	21
3.1.3 Power Specifications Summary	22
3.2 Chassis	23
3.3 Midplane Board	26
3.3.1 Mechanical Outline	26
3.3.2 3D Renderings	27
3.4 Compute Module	28
3.4.1 Introduction	28
3.4.2 Drawings	29
3.5 Chassis Management Module	29
3.5.1 Introduction	29
3.5.1.1 CMM	29
3.5.1.2 CMM2	29
3.5.2 Mechanical Outline	31
3.5.3 Block Diagram	32
3.5.3.1 CMM	32
3.5.3.2 CMM2	32
3.5.4 Drawings	33
3.5.5 Architectural Overview	33
3.6 Ethernet Switch Module	34
3.6.1 Introduction	34
3.6.2 Mechanical Outline	35
3.6.3 Block Diagram	36
3.6.4 Architectural Overview	36
3.7 Storage Controller Module	37
3.7.1 Storage Subsystem Introduction	37
3.7.2 Mechanical Outline	37
3.7.3 Storage Controller Module View	38
3.7.4 Architectural Overview	38
3.7.4.1 Storage Controller Module Interface	38
3.7.4.2 Interposer Card Functionality	38
3.7.4.3 Drive Backplane Interface	39
3.8 Power Supply Module	39
3.9 Jumpers and LEDs	40
4. Product Regulatory Requirements	41
4.1 Product Regulatory Compliance	41
4.1.1 Product Safety Compliance	41
4.1.2 Product EMC Compliance - Class A Compliance	41
4.1.3 Product Ecology Compliance	41
4.1.4 Certifications/Registrations/Declarations	42
4.2 Product Regulatory Compliance Markings	42
4.3 Regulated Specified Components	47
4.4 Electromagnetic Compatibility Notices	48
4.4.1 FCC Verification Statement (USA)	48
4.4.2 ICES-003 (Canada)	49
4.4.3 Europe (CE Declaration of Conformity)	49
4.4.4 VCCI (Japan)	50
4.4.5 BSMI (Taiwan)	50
Glossary	52

Intel MFS2600KI Technical Product Specification - Page 29

Chassis Management Module

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