Intel MFS2600KI Technical Product Specification - Page 2

Rivision History

Intel® Modular Server System TPS

ii

Revision 1.7

Intel order number E15155-010

Revision History

Date

Revision

Number

Modifications

July, 2007

0.88

Initial release.

September, 2007

1.0

Updated the document.

February, 2008

1.1


June, 2008

1.2

Updated Power Budget of Hardware Components, Table 5. Added 3.5-inch drive

bay information for the Intel

®

Modular Server System MFSYS35.

November, 2008

1.3

Updated System Details, power and heat specifications.

June, 2009

1.4


May, 2010

1.5

Removed CCC and CNCA.

December, 2010

1.6

Added MFSYS25V2 info.

March, 2011

1.7

Added CMM2 power compensation info.

Disclaimers

Information in this document is provided in connection with Intel

®

products. No license, express or implied, by

estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's

Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any

express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to

fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property

right. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel may make

changes to specifications and product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” inches or

“undefined” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or

incompatibilities arising from future changes to them.

The Intel

®

Modular Server System may contain design defects or errors known as errata, which may cause the

product to deviate from published specifications. Current characterized errata are available on request.

Intel Corporation server baseboards contain a number of high-density VLSI and power delivery components that need

adequate airflow to cool. Intel’s own chassis are designed and tested to meet the intended thermal requirements of

these components when the fully integrated system is used together. It is the responsibility of the system integrator

that chooses not to use Intel developed server building blocks to consult vendor datasheets and operating parameters

to determine the amount of airflow required for their specific application and environmental conditions. Intel

Corporation cannot be held responsible if components fail or the server board does not operate correctly when used

outside any of their published operating or non-operating limits.

Intel and Xeon are trademarks or registered trademarks of Intel Corporation.

*Other brands and names may be claimed as the property of others. Copyright © Intel Corporation 2007-2011

Section	Page
Title Page	1
Revision History	2
Table of Contents	3
List of Figures	5
List of Tables	6
1. Product Overview	8
2. System Overview	9
2.1 Introduction	9
2.2 External Chassis Features – Front	12
2.2.1 Compute Module	13
2.2.2 Storage Enclosure	13
2.2.3 I/O Cooling Module	13
2.3 External Chassis Features – Rear	14
2.3.1 Power Supply Module	14
2.3.2 I/O Slots	14
2.3.2.1 Ethernet Switch Module	14
2.3.2.2 Storage Controller Module	15
2.3.3 Chassis Management Module	15
2.3.4 Main Cooling Module	15
2.4 Internal Chassis Features	15
2.4.1 Midplane Board	17
2.4.2 Storage Interposer Board	18
2.5 Mounting and Service Features	18
2.5.1 Chassis	18
2.5.2 Rails	18
2.6 Server Management	18
2.6.1 Chassis Management Module	19
2.6.2 Compute Module Management	19
2.7 Reliability, Availability, Serviceability, Usability, Manageability (RASUM)	20
3. System Details	21
3.1 Specifications	21
3.1.1 Environmental Specifications Summary	21
3.1.2 Physical Specifications Summary	21
3.1.3 Power Specifications Summary	22
3.2 Chassis	23
3.3 Midplane Board	26
3.3.1 Mechanical Outline	26
3.3.2 3D Renderings	27
3.4 Compute Module	28
3.4.1 Introduction	28
3.4.2 Drawings	29
3.5 Chassis Management Module	29
3.5.1 Introduction	29
3.5.1.1 CMM	29
3.5.1.2 CMM2	29
3.5.2 Mechanical Outline	31
3.5.3 Block Diagram	32
3.5.3.1 CMM	32
3.5.3.2 CMM2	32
3.5.4 Drawings	33
3.5.5 Architectural Overview	33
3.6 Ethernet Switch Module	34
3.6.1 Introduction	34
3.6.2 Mechanical Outline	35
3.6.3 Block Diagram	36
3.6.4 Architectural Overview	36
3.7 Storage Controller Module	37
3.7.1 Storage Subsystem Introduction	37
3.7.2 Mechanical Outline	37
3.7.3 Storage Controller Module View	38
3.7.4 Architectural Overview	38
3.7.4.1 Storage Controller Module Interface	38
3.7.4.2 Interposer Card Functionality	38
3.7.4.3 Drive Backplane Interface	39
3.8 Power Supply Module	39
3.9 Jumpers and LEDs	40
4. Product Regulatory Requirements	41
4.1 Product Regulatory Compliance	41
4.1.1 Product Safety Compliance	41
4.1.2 Product EMC Compliance - Class A Compliance	41
4.1.3 Product Ecology Compliance	41
4.1.4 Certifications/Registrations/Declarations	42
4.2 Product Regulatory Compliance Markings	42
4.3 Regulated Specified Components	47
4.4 Electromagnetic Compatibility Notices	48
4.4.1 FCC Verification Statement (USA)	48
4.4.2 ICES-003 (Canada)	49
4.4.3 Europe (CE Declaration of Conformity)	49
4.4.4 VCCI (Japan)	50
4.4.5 BSMI (Taiwan)	50
Glossary	52

Intel MFS2600KI Technical Product Specification - Page 2

Revision History, Disclaimers - corporation

Page 2 highlights