Intel X3350 Design Guide

Intel X3350 - Xeon 2.66 Ghz 12M L2 Cache 1333MHz FSB LGA775 Quad-Core Processor Manual

Get Intel X3350 - Xeon 2.66 Ghz 12M L2 Cache 1333MHz FSB LGA775 Quad-Core Processor PDF manuals and user guides
UPC - 735858199872
View all Intel X3350 manuals
Add to My Manuals
Save this manual to your list of manuals

Intel X3350 manual content summary:

  • Intel X3350 | Design Guide - Page 1
    Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide August 2010 Order Number: 323107-002US
  • Intel X3350 | Design Guide - Page 2
    instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The Intel® Xeon® Processor by Intel to identify products, technologies, or services in
  • Intel X3350 | Design Guide - Page 3
    Drawing 12 2.1.2 Processor Component Keep-Out 27 4.2 Assembly of ILM to a Motherboard 28 5 LGA1366 Socket and ILM Electrical, Processor Thermal Features 48 6.2.1 Processor Temperature 48 6.2.2 Adaptive Thermal Monitor 48 August 2010 Order Number: 323107-002US Intel® Xeon® Processor
  • Intel X3350 | Design Guide - Page 4
    68 8.2.3 Recommended BIOS/Processor/Memory Test Procedures 68 8.3 Material and Recycling Requirements 68 A Component Suppliers 70 B Mechanical Drawings 72 C Socket Mechanical Drawings 89 Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 4 August 2010
  • Intel X3350 | Design Guide - Page 5
    6-2 Intel® Xeon® Processor EC3539 and EC5539 Thermal Profile 39 6-3 Intel® Xeon® Processor LC5528 Thermal Profile 40 6-4 Intel® Xeon® Processor LC5518 Thermal Profile 42 6-5 Intel® Celeron® Processor P1053 Thermal Profile 43 6-6 Intel® Xeon® Processor LC3528 Thermal Profile 44 6-7 Intel® Xeon
  • Intel X3350 | Design Guide - Page 6
    Level 67 A-1 Heatsinks and Thermal Interface Material 70 A-2 LGA1366 Socket and ILM Components 71 B-1 Mechanical Drawing List 72 C-1 Mechanical Drawing List 89 Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 6 August 2010 Order Number: 323107-002US
  • Intel X3350 | Design Guide - Page 7
    Table 5-3, Socket and ILM Mechanical Specifications Modified Section 7.6.1, Fan Speed Control First release § § Revision Date August 2010 February 2010 August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design
  • Intel X3350 | Design Guide - Page 8
    (ILM) and back plate. Figure 1-1. Intel® Xeon® Processor C5500/C3500 Series Socket Stack-up Heatsink Socket processor heatsinks. Other processor specifications are provided in the Intel® Xeon® Processor C5500/ C3500 Series Datasheet. August 2010 Order Number: 323107-002US Intel® Xeon® Processor
  • Intel X3350 | Design Guide - Page 9
    Intel® Xeon® Processor C5500/C3500 Series Datasheet, Volume 1 Intel® Xeon® Processor C5500/C3500 Series Datasheet, Volume 2 Intel® Xeon® Processor 5500 Series Mechanical Model Intel® Xeon® Processor input to the CPU. The VRM tells the CPU how much current it is drawing. The processor mates with the
  • Intel X3350 | Design Guide - Page 10
    processor can dissipate. A power reduction feature designed to decrease temperature after the processor the processor case to the heatsink. The measured ambient temperature locally surrounding the processor. The Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design
  • Intel X3350 | Design Guide - Page 11
    as the mating surface for processor component thermal solutions, such as a heatsink. Figure 2-1 shows a sketch of the processor package components and how they motherboard are included for reference and are not part of processor package. August 2010 Order Number: 323107-002US Intel® Xeon® Processor
  • Intel X3350 | Design Guide - Page 12
    .) 2. IHS parallelism and tilt 3. Land dimensions 4. Top-side and back-side component keep-out dimensions 5. Reference datums 6. All drawing dimensions are in mm Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 12 August 2010 Order Number: 323107-002US
  • Intel X3350 | Design Guide - Page 13
    Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 13 August 2010 Order Number: 323107-002US 8 7 6 THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS MAY NOT BE DISCLOSED, REPRODUCED,
  • Intel X3350 | Design Guide - Page 14
    August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 14 8 7 6 5 THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS MAY NOT BE DISCLOSED, REPRODUCED,
  • Intel X3350 | Design Guide - Page 15
    The processor can be inserted into and removed from a LGA1366 socket 15 times. The socket should meet the LGA1366 requirements detailed in Section 5. August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 15
  • Intel X3350 | Design Guide - Page 16
    Legend: GRP1LINE1: GRP1LINE2: GRP1LINE3: GRP1LINE4: GRP1LINE5: Mark Text (Production Mark): INTEL{M}{C}'YY PROC# SUB-BRAND SSPEC XXXXX SPEED/CACHE/INTC {FPO} {e4} Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 16 August 2010 Order Number: 323107-002US
  • Intel X3350 | Design Guide - Page 17
    land coordinates. The coordinates are referred to throughout the document to identify processor lands. Processor Land Coordinates and Quadrants, Bottom View § August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 17
  • Intel X3350 | Design Guide - Page 18
    for the Intel® Xeon® processor C5500/ motherboard. The socket has 1366 contacts with 1.016 mm X 1.016 mm pitch (X by Y) in a 43 x 41 grid array with 21 x 17 grid depopulation in the center of the array and selective depopulation elsewhere. The socket must be compatible with the package (processor
  • Intel X3350 | Design Guide - Page 19
    LGA1366 Socket Figure 3-2. LGA1366 Socket Contact Numbering (Top View of Socket) Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 19 August 2010 Order Number: 323107-002US
  • Intel X3350 | Design Guide - Page 20
    platforms. Drill keepout is explained in section 3.2.1 of the Intel® Xeon® 5500 Platform Design Guide (PDG). Select PCB suppliers are capable of producing 40 AT AV AY BB August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design
  • Intel X3350 | Design Guide - Page 21
    with immersion silver (ImAg) motherboard surface finish and a SAC alloy solder paste. The co-planarity (profile) and true position requirements are defined in Appendix C. Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 21 August 2010 Order Number
  • Intel X3350 | Design Guide - Page 22
    high strength copper alloy. For the area on socket contacts where processor lands will mate, there is a 0.381 μm [15 contacts. Cover retention must be sufficient to support the socket weight during lifting, translation, 002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal
  • Intel X3350 | Design Guide - Page 23
    Removal As indicated in Figure 3-6, access is provided to facilitate manual installation and removal of the package. . Figure 3-6. To assist IHS height above the motherboard. Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 23 August 2010 Order Number
  • Intel X3350 | Design Guide - Page 24
    is mounted on the motherboard. LGA1366 and the Intel has defined selected solder joints of the socket as non-critical to function (NCTF) when evaluating package solder joints post environmental testing. The processor Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/
  • Intel X3350 | Design Guide - Page 25
    E G J L N R U W AA AC AE AG AJ AL AN AR AU AW BA B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY BB For platforms supporting the DP processor land C3 is CTF. § Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 25 August 2010 Order Number: 323107-002US
  • Intel X3350 | Design Guide - Page 26
    test flow. See the Manufacturing Advantage Service collateral for this platform for additional guidance. The ILM has two critical functions: deliver the force to seat the processor on the processor package. When Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design
  • Intel X3350 | Design Guide - Page 27
    surface feature that provides alignment for the back plate to the motherboard for proper assembly of the ILM around the socket. A clearance processors in 1-socket workstation platforms are covered in the Intel® Xeon® Processor 3500 Series Thermal/Mechanical Design Guide. Intel® Xeon® Processor
  • Intel X3350 | Design Guide - Page 28
    in the motherboard provide alignment to driver fasten the ILM cover assembly to the back plate with the four captive fasteners. Torque to 8 inch-pounds. The length of the threaded studs accommodate board thicknesses from 0.062" 0.100". August 2010 Order Number: 323107-002US Intel® Xeon® Processor
  • Intel X3350 | Design Guide - Page 29
    . Figure 4-3. ILM Assembly Independent Loading Mechanism (ILM) Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 29 August 2010 Order Number: 323107-002US
  • Intel X3350 | Design Guide - Page 30
    1 orientation with respect to ILM lever. See the Manufacturing Advantage Service for additional details on fixtures and assembly guidance. Figure 4-4. Pin1 and ILM Lever § August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design
  • Intel X3350 | Design Guide - Page 31
    under socket < 96 °C The specific via used for temperature measurement is located on the bottom of the motherboard between pins AY23, AY22, AW23, and AW22. See Figure 5-1. August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design
  • Intel X3350 | Design Guide - Page 32
    via on the underside of the motherboard. 3. Once the glue dries, reinstall the back plate and measure the temperature. Figure 5-1. Socket Temperature Measurement Location Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 32 August 2010 Order Number
  • Intel X3350 | Design Guide - Page 33
    standard use condition. Exceeding these limits during test may result in component failure. The socket body Intel® Xeon® Processor 5500 Series Thermal/Mechanical Design Guide (TMDG), Revision 2.1 for detailed board deflection guidance. August 2010 Order Number: 323107-002US Intel® Xeon® Processor
  • Intel X3350 | Design Guide - Page 34
    from average of every chain contact resistance for each part used in testing, with a chain contact resistance defined as the resistance of each chain from 24° C to 107° C Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 34 August 2010 Order Number: 323107
  • Intel X3350 | Design Guide - Page 35
    based on the expected field use environment for these products. The test sequence for new sockets will be developed using the knowledge-based reliability ftp://download.intel.com/technology/itj/q32000/pdf/reliability.pdf. § August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500
  • Intel X3350 | Design Guide - Page 36
    may have the same TDP and same spec). The Intel® Xeon® processor C5500/C3500 series implements a methodology for managing processor temperatures that is intended to support acoustic noise reduction through fan speed control and to assure processor reliability. Selection of the appropriate fan speed
  • Intel X3350 | Design Guide - Page 37
    VIDs found in the Datasheet. The Intel® Xeon® processor C5500/ C3500 series may be shipped under multiple VIDs for each frequency. 5. FMB (Flexible Motherboard) guidelines provide a design target for meeting all planned processor frequency requirements. Intel® Xeon® Processor EC5549 and EC5509
  • Intel X3350 | Design Guide - Page 38
    .0 74.5 76.0 77.6 Table 6-3. Intel® Xeon® Processor EC3539 and EC5539 Thermal Specifications Core Frequency Launch Datasheet. The Intel® Xeon® processor C5500/ C3500 series Intel® Xeon® processor C5500/C3500 series may be shipped under multiple VIDs for each frequency. 5. FMB (Flexible Motherboard
  • Intel X3350 | Design Guide - Page 39
    45 50 55 60 65 Power [W] Table 6-4. Notes: 1. Intel® Xeon® processor EC3539 and EC5539 Thermal Profile is representative of a volumetrically unconstrained 74.6 Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 39 August 2010 Order Number: 323107-002US
  • Intel X3350 | Design Guide - Page 40
    Datasheet. The Intel® Xeon® processor C5500/ C3500 series may be shipped under multiple VIDs for each frequency. 5. FMB (Flexible Motherboard) guidelines provide a design target for meeting all planned processor frequency requirements. Intel® Xeon® Processor of Intel® Xeon® processor LC5528 nominal
  • Intel X3350 | Design Guide - Page 41
    VIDs found in the Datasheet. The Intel® Xeon® processor C5500/ C3500 series may be shipped under multiple VIDs for each frequency. 5. FMB (Flexible Motherboard) guidelines provide a design target for meeting all planned processor frequency requirements. Intel® Xeon® Processor C5500/C3500 Series
  • Intel X3350 | Design Guide - Page 42
    2. Implementation of Intel® Xeon® processor LC5518 nominal and short the processor thermal specifications and may result in permanent damage to the processor. Intel® Xeon® Processor LC5518 Thermal : 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design
  • Intel X3350 | Design Guide - Page 43
    found in the Datasheet. The Intel® Xeon® processor C5500/ C3500 series may be shipped under multiple VIDs for each frequency. 5. FMB (Flexible Motherboard) guidelines provide a design target for meeting all planned processor frequency requirements. Intel® Celeron® Processor P1053 Thermal Profile
  • Intel X3350 | Design Guide - Page 44
    Datasheet. The Intel® Xeon® processor C5500/ C3500 series may be shipped under multiple VIDs for each frequency. 5. FMB (Flexible Motherboard) guidelines provide a design target for meeting all planned processor frequency requirements. Intel® Xeon® Processor : 1. Intel® Xeon® processor LC3528 Thermal
  • Intel X3350 | Design Guide - Page 45
    VIDs found in the Datasheet. The Intel® Xeon® processor C5500/ C3500 series may be shipped under multiple VIDs for each frequency. 5. FMB (Flexible Motherboard) guidelines provide a design target for meeting all planned processor frequency requirements. Intel® Xeon® Processor C5500/C3500 Series and
  • Intel X3350 | Design Guide - Page 46
    [C] 40 0 5 10 15 20 23 Power [W] Notes: 1. Intel® Xeon® processor LC3518 Thermal Profile is representative of a volumetrically constrained platform. See Table 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 46
  • Intel X3350 | Design Guide - Page 47
    mm. 4. C1: Max = 39.1 mm, Min = 38.9 mm. 5. C2: Max = 36.6 mm, Min = 36.4 mm. 6. C3: Max = 2.3 mm, Min = 2.2 mm 7. C4: Max = 2.3 mm, Min = 2.2 mm. Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 47 August 2010 Order Number: 323107-002US
  • Intel X3350 | Design Guide - Page 48
    require any additional hardware, software drivers, or interrupt handling routines. The following sections provide more details on the different TCC mechanisms used by the Intel® Xeon® processor C5500/C3500 series. August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and
  • Intel X3350 | Design Guide - Page 49
    to support this method. During the voltage change, it will be necessary to transition through multiple VID codes to reach the target operating voltage. Each step will be one VID table entry (see the Intel® Xeon® Processor C5500/C3500 Series Datsheet). The processor continues to execute instructions
  • Intel X3350 | Design Guide - Page 50
    processor processor frequency. A small amount processor processor provides an auxiliary mechanism that allows system software to force the processor Intel® Xeon® Processor 5500 Series must not rely on software processor processor hot), is asserted when the processor the processor (any processor processor processor
  • Intel X3350 | Design Guide - Page 51
    Datasheet. THERMTRIP# activation is independent of processor activity. If THERMTRIP# is asserted, processor core voltage (VCC) must be removed within the timeframe defined in the Datasheet PECI is Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 51 August
  • Intel X3350 | Design Guide - Page 52
    Processor Thermal Data Sample Rate and Filtering The processor vs. time the processor DTS implements an via PECI. Within the processor, the DTS converts an reported via the internal processor MSR will be in whole Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design
  • Intel X3350 | Design Guide - Page 53
    # is pulled to Vtt. • Address 31h when PECI_ID# is terminated to ground. 6.3.2.2 PECI Command Support PECI commands are in the Intel® Xeon® Processor C5500/C3500 Series Datasheet). 6.3.2.3 PECI Fault Handling Requirements PECI is largely a fault tolerant interface, including noise immunity and
  • Intel X3350 | Design Guide - Page 54
    thermal specifications and to provide guidance for heatsink design. Other Intel® Xeon® Processor 5500 Series thermal solutions may work with the same retention. See the Intel® Xeon® Processor 5500 Series Thermal/Mechanical Design Guide. Note: Custom heatsinks and high airflow ATCA designs can cool
  • Intel X3350 | Design Guide - Page 55
    2 + 2.0e-02CFM Mean Ψca = 0.1430 + 1.141*CFM -0.817 σ = 0.0016 C/W 10 20 30 40 CFM Through Fins 1.40 1.20 1.00 0.80 0.60 0.40 0.20 0.00 50 Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 55 August 2010 Order Number: 323107-002US
  • Intel X3350 | Design Guide - Page 56
    Through Fins Heat Pipe Considerations Figure 7-3 shows the orientation and position of the TTV die. The TTV die is sized and positioned similar to the processor die. August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design
  • Intel X3350 | Design Guide - Page 57
    Cache Cache Core Core 1 Core 2 Uncore Core 3 Core 4 13.2 42.5 19.3 NOT TO SCALE All Dimensions in mm 7.3 Assembly Figure 7-4. 1U Reference Heatsink Assembly Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 57 August 2010 Order Number: 323107-002US
  • Intel X3350 | Design Guide - Page 58
    four threaded nuts of the back plate. Using a #2 Phillips driver, torque the four captive screws to 8 inch-pounds. This assembly as used with previous Dual-Core Intel® Xeon® processor 5000 sequence). Direct contact between Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/
  • Intel X3350 | Design Guide - Page 59
    through the heatsink fins. Figure 7-5 illustrates the thermal characterization parameters. Figure 7-5. Processor Thermal Characterization Parameter Relationships Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 59 August 2010 Order Number: 323107-002US
  • Intel X3350 | Design Guide - Page 60
    Datasheet). NEBS thermal profiles help relieve thermal constraints for Short-Term NEBS conditions. To help reliability, processors must meet the nominal thermal profile under standard operating conditions and can only rise up to the Short-Term spec Intel® Xeon® Processor C5500/ C3500 Series Datasheet
  • Intel X3350 | Design Guide - Page 61
    may be extracted by issuing a Mailbox or an RDMSR instruction. See the appropriate Electrical, Mechanical, and Thermal Specifications (EMTS) for more information. Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 61 August 2010 Order Number: 323107-002US
  • Intel X3350 | Design Guide - Page 62
    Intel® Xeon® processor EC5549 -16 Intel® Xeon® processor EC5509 -10 Intel® Xeon® processor EC3539 -20 Intel® Xeon® processor LC5528 -14 Intel® Xeon® processor EC5539 -24 Intel® Xeon® processor LC5518 -8 Intel® Celeron® processor P1053 -26 Intel® Xeon® processor LC3528 -26 Intel® Xeon
  • Intel X3350 | Design Guide - Page 63
    Absolute Processor Temperature Intel does not test any third-party software that reports absolute processor temperature. As such, Intel cannot the 60W processor. Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 63 August 2010 Order Number: 323107-002US
  • Intel X3350 | Design Guide - Page 64
    , retention not production ready. Figure 7-8. UP ATCA System Layout Airflow direction Note: Heatsink should be optimized for the layout. August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design
  • Intel X3350 | Design Guide - Page 65
    Figure 7-9. UP ATCA Heat Sink Drawing Thermal Solutions § Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 65 August 2010 Order Number: 323107-002US
  • Intel X3350 | Design Guide - Page 66
    Quality and Reliability Requirements 8.1 Table 8-1. Use Conditions Intel evaluates reliability performance based on the use conditions ( 800 - 3300 hrs at 125° C August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design
  • Intel X3350 | Design Guide - Page 67
    a visual inspection after assembly, and BIOS/Processor/memory test. The stress test should be then followed by a visual inspection and then BIOS/processor/memory test. Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 67 August 2010 Order Number: 323107
  • Intel X3350 | Design Guide - Page 68
    is that the system under test shall successfully complete the checking of BIOS, basic processor functions, and memory, without any errors. Intel PC Diags is an example of August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design
  • Intel X3350 | Design Guide - Page 69
    substance thresholds as proposed by the EU or (2) an approved/pending exemption applies. RoHS implementation details are not fully defined and may change. § Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 69 August 2010 Order Number: 323107-002US
  • Intel X3350 | Design Guide - Page 70
    Suppliers A Component Suppliers The part numbers below represent Intel reference designs and collaborative designs for 1U and ATCA to server back plate (Table A-2). August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design
  • Intel X3350 | Design Guide - Page 71
    Table A-2. LGA1366 Socket and ILM Components Item Intel PN Foxconn ILM Cover Assembly Server Back Plate Mechanical models are listed in Table 1-1. § Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 71 August 2010 Order Number: 323107-002US
  • Intel X3350 | Design Guide - Page 72
    B-4 Figure B-5 Figure B-6 Figure B-7 Figure B-8 Figure B-9 Figure B-10 Figure B-11 Figure B-12 Figure B-13 Figure B-14 Figure B-15 Figure B-16 August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design
  • Intel X3350 | Design Guide - Page 73
    Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 73 8 7 6 5 4 THIS DRAWING CONTAINS INTEL IS DEFINED AS ONE WHERE ALL COMPONENTS PLACED ON THE SURFACE OF THE MOTHERBOARD MUST HAVE A MAXIMUM HEIGHT NO GREATER THAN THE HEIGHT DEFINED BY THAT
  • Intel X3350 | Design Guide - Page 74
    Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 74 August 2010 Order Number: 323107 ] 3X 80.00 [3.150 ] 85.00 [3.346 ] A 8 AS VIEWED FROM PRIMARY SIDE OF THE MOTHERBOARD (DETAILS) 7 6 5 4 4X 6.00 [0.236 ] NO ROUTE COPPER PAD ON SURFACE 3 DWG. NO
  • Intel X3350 | Design Guide - Page 75
    Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 75 85.00 [3.346 ] 70.50 [2.776 ] 47.15 [1.856 ] 32.85 [1.293 ] 9.50 [0.374 ] 0.00 [0.000] 5.00 [0.197 ] 8 7 6 5 4 THIS DRAWING CONTAINS INTEL FROM SECONDARY SIDE OF THE MOTHERBOARD (DETAILS) 6 5 4
  • Intel X3350 | Design Guide - Page 76
    COMPATIBILITY. DIAMETER 4.0 --> 4.03 THIS HEIGHT REPRESENTS AN ARBITRARY MOTHERBOARD THICKNESS G REMOVED 3.0 MM HEIGHT RESTRICTION ZONE TO THE LEFT 08/02/07 02/24/09 B Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 76 A 8 SECONDARY SIDE 3D HEIGHT
  • Intel X3350 | Design Guide - Page 77
    Figure B-5. 1U Reference Heatsink Assembly (Sheet 1 of 2) Mechanical Drawings ASSEMBLY, HEAT SINK, 1U Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 77 August 2010 Order Number: 323107-002US
  • Intel X3350 | Design Guide - Page 78
    Mechanical Drawings Figure B-6. 1U Reference Heatsink Assembly (Sheet 2 of 2) August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 78
  • Intel X3350 | Design Guide - Page 79
    Figure B-7. 1U Reference Heatsink Fin and Base (Sheet 1 of 2) Mechanical Drawings Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 79 August 2010 Order Number: 323107-002US
  • Intel X3350 | Design Guide - Page 80
    Mechanical Drawings Figure B-8. 1U Reference Heatsink Fin and Base (Sheet 2 of 2) August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 80
  • Intel X3350 | Design Guide - Page 81
    Figure B-9. Heatsink Shoulder Screw (1U, 2U, and Tower) Mechanical Drawings Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 81 August 2010 Order Number: 323107-002US
  • Intel X3350 | Design Guide - Page 82
    Mechanical Drawings Figure B-10. Heatsink Compression Spring (1U, 2U, and Tower) August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 82
  • Intel X3350 | Design Guide - Page 83
    Figure B-11. Heatsink Retaining Ring (1U, 2U, and Tower) Mechanical Drawings Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 83 August 2010 Order Number: 323107-002US
  • Intel X3350 | Design Guide - Page 84
    Mechanical Drawings Figure B-12. Heatsink Load Cup (1U, 2U, and Tower) August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 84
  • Intel X3350 | Design Guide - Page 85
    Figure B-13. ATCA Reference Heatsink Assembly (Sheet 1 of 2) Mechanical Drawings Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 85 August 2010 Order Number: 323107-002US
  • Intel X3350 | Design Guide - Page 86
    Mechanical Drawings Figure B-14. ATCA Reference Heatsink Assembly (Sheet 2 of 2) August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 86
  • Intel X3350 | Design Guide - Page 87
    Figure B-15. ATCA Reference Heatsink Fin and Base (Sheet 1 of 2) Mechanical Drawings Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 87 August 2010 Order Number: 323107-002US
  • Intel X3350 | Design Guide - Page 88
    Mechanical Drawings Figure B-16. ATCA Reference Heatsink Fin and Base (Sheet 2 of 2) August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 88
  • Intel X3350 | Design Guide - Page 89
    - (Sheet 2 of 4)" "Socket Mechanical Drawing - (Sheet 3 of 4)" "Socket Mechanical Drawing - (Sheet 4 of 4)" Figure Number Figure C-1 Figure C-2 Figure C-3 Figure C-4 August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design
  • Intel X3350 | Design Guide - Page 90
    Figure C-1. Socket Mechanical Drawing - (Sheet 1 of 4) Socket Mechanical Drawings Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 90 August 2010 Order Number: 323107-002US
  • Intel X3350 | Design Guide - Page 91
    Socket Mechanical Drawings Figure C-2. Socket Mechanical Drawing - (Sheet 2 of 4) August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 91
  • Intel X3350 | Design Guide - Page 92
    Figure C-3. Socket Mechanical Drawing - (Sheet 3 of 4) Socket Mechanical Drawings Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 92 August 2010 Order Number: 323107-002US
  • Intel X3350 | Design Guide - Page 93
    Socket Mechanical Drawings Figure C-4. Socket Mechanical Drawing - (Sheet 4 of 4) August 2010 Order Number: 323107-002US § Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 93
  • 1
  • 2
  • 3
  • 4
  • 5
  • 6
  • 7
  • 8
  • 9
  • 10
  • 11
  • 12
  • 13
  • 14
  • 15
  • 16
  • 17
  • 18
  • 19
  • 20
  • 21
  • 22
  • 23
  • 24
  • 25
  • 26
  • 27
  • 28
  • 29
  • 30
  • 31
  • 32
  • 33
  • 34
  • 35
  • 36
  • 37
  • 38
  • 39
  • 40
  • 41
  • 42
  • 43
  • 44
  • 45
  • 46
  • 47
  • 48
  • 49
  • 50
  • 51
  • 52
  • 53
  • 54
  • 55
  • 56
  • 57
  • 58
  • 59
  • 60
  • 61
  • 62
  • 63
  • 64
  • 65
  • 66
  • 67
  • 68
  • 69
  • 70
  • 71
  • 72
  • 73
  • 74
  • 75
  • 76
  • 77
  • 78
  • 79
  • 80
  • 81
  • 82
  • 83
  • 84
  • 85
  • 86
  • 87
  • 88
  • 89
  • 90
  • 91
  • 92
  • 93
Order Number:
323107-002US
Intel
®
Xeon
®
Processor
C5500/C3500 Series and LGA1366
Socket
Thermal/Mechanical Design Guide
August 2010