Intel X3350 Design Guide - Page 59

Thermal Design

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Thermal Solutions 7.5 Thermal Design 7.5.1 Thermal Characterization Parameter The case-to-local ambient Thermal Characterization Parameter (ΨCA) is defined by: Equation 7-1. ΨCA = (TCASE - TLA) / TDP Where: TCASE = TLA = TDP = Processor case temperature (°C). For TCASE specification see Section 6. Local ambient temperature in chassis at processor (°C). TDP (W) assumes all power dissipates through the integrated heat spreader. This inexact assumption is convenient for heatsink design. TTVs are often used to dissipate TDP. Correction offsets account for differences in temperature distribution between processor and TTV. Equation 7-2. ΨCA = ΨCS + ΨSA Where: ΨCS = ΨSA = Thermal characterization parameter of the TIM (°C/W) is dependent on the thermal conductivity and thickness of the TIM. Thermal characterization parameter from heatsink-to-local ambient (°C/W) is dependent on the thermal conductivity and geometry of the heatsink and dependent on the air velocity through the heatsink fins. Figure 7-5 illustrates the thermal characterization parameters. Figure 7-5. Processor Thermal Characterization Parameter Relationships Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 59 August 2010 Order Number: 323107-002US

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Thermal Solutions
Intel
®
Xeon
®
Processor C5500/C3500 Series and LGA1366 Socket
Thermal/Mechanical Design Guide
August 2010
59
Order Number: 323107-002US
7.5
Thermal Design
7.5.1
Thermal Characterization Parameter
The case-to-local ambient Thermal Characterization Parameter (
Ψ
CA
) is defined by:
Equation 7-1.
Ψ
CA
= (T
CASE
- T
LA
) / TDP
Where:
T
CASE
=
Processor case temperature (°C). For
T
CASE
specification see
Section 6
.
T
LA
=
Local ambient temperature in chassis at processor (°C).
TDP
=
TDP (W) assumes all power dissipates through the integrated heat
spreader. This inexact assumption is convenient for heatsink design.
TTVs are often used to dissipate TDP. Correction offsets account for
differences in temperature distribution between processor and TTV.
Equation 7-2.
Ψ
CA
=
Ψ
CS
+
Ψ
SA
Where:
Ψ
CS
=
Thermal characterization parameter of the TIM (°C/W) is dependent
on the thermal conductivity and thickness of the TIM.
Ψ
SA
=
Thermal characterization parameter from heatsink-to-local ambient
(°C/W) is dependent on the thermal conductivity and geometry of the
heatsink and dependent on the air velocity through the heatsink fins.
Figure 7-5
illustrates the thermal characterization parameters.
Figure 7-5.
Processor Thermal Characterization Parameter Relationships