Intel X3350 Design Guide - Page 27

Figure 4-1. ILM Cover Assembly Independent Loading Mechanism (ILM) 4.1.2 ILM Back Plate Design Overview The unified back plate for 2-socket server and 2-socket Workstation products consists of a flat steel back plate with threaded studs for ILM attach, and internally threaded nuts for heatsink attach. The threaded studs have a smooth surface feature that provides alignment for the back plate to the motherboard for proper assembly of the ILM around the socket. A clearance hole is located at the center of the plate to allow access to test points and backside capacitors. An additional cut-out on two sides provides clearance for backside voltage regulator components. An insulator is preapplied. Back plates for processors in 1-socket workstation platforms are covered in the Intel® Xeon® Processor 3500 Series Thermal/Mechanical Design Guide. Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 27 August 2010 Order Number: 323107-002US