Intel X3350 Design Guide - Page 9

Introduction 1.1 Reference Documents Material and concepts in the following documents may be beneficial when reading this document. Table 1-1. Reference Documents Document European Blue Angel Recycling Standards Intel® Xeon® Processor C5500/C3500 Series Datasheet, Volume 1 Intel® Xeon® Processor C5500/C3500 Series Datasheet, Volume 2 Intel® Xeon® Processor 5500 Series Mechanical Model Intel® Xeon® Processor 5500 Series Thermal Model Entry-level Electronics Bay Specification Document# Notes 3 323103 1 323317 1 321326 2 321327 2 4 Notes: 1. See http://developer.intel.com/design/intarch/xeon5000/documentation.htm 2. See http://www.intel.com/p/en_US/products/server/processor/xeon5000/tools 3. Available at http://www.blauer-engel.de 4. Available at http://ssiforum.oaktree.com/ 1.2 Definition of Terms Table 1-2. Terms and Descriptions (Sheet 1 of 2) Term Bypass DTS FSC IHS ILM IMON LGA1366 socket PECI ΨCA ΨCS ΨSA TCASE TCASE_MAX Description Bypass is the area between a passive heatsink and any object that can act to form a duct. For this example, it can be expressed as a dimension away from the outside dimension of the fins to the nearest surface. Digital Thermal Sensor reports a relative die temperature as an offset from TCC activation temperature. Fan Speed Control Integrated Heat Spreader: a component of the processor package used to enhance the thermal performance of the package. Component thermal solutions interface with the processor at the IHS surface. Independent Loading Mechanism provides the force needed to seat the 1366-LGA land package onto the socket contacts. The current monitor input to the CPU. The VRM tells the CPU how much current it is drawing. The processor mates with the system board through this surface mount, 1366-land socket. The Platform Environment Control Interface (PECI) is a one-wire interface that provides a communication channel between Intel processor and chipset components to external monitoring devices. Case-to-ambient thermal characterization parameter (psi). A measure of thermal solution performance using total package power. Defined as (TCASE - TLA) / Total Package Power. Heat source should always be specified for Ψ measurements. Case-to-sink thermal characterization parameter. A measure of thermal interface material performance using total package power. Defined as (TCASE - TS) / Total Package Power. Sink-to-ambient thermal characterization parameter. A measure of heatsink thermal performance using total package power. Defined as (TS - TLA) / Total Package Power. The case temperature of the processor, measured at the geometric center of the topside of the IHS. The maximum case temperature as specified in a component specification. Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 9 August 2010 Order Number: 323107-002US