Intel X3350 Design Guide - Page 70

Component Suppliers A Component Suppliers The part numbers below represent Intel reference designs and collaborative designs for 1U and ATCA heatsinks. These components are still in development and might not meet the criteria in Section 8. Customer implementation of these components may be unique and require validation by the customer. Customers can obtain these components directly from the suppliers below. Table A-1. Heatsinks and Thermal Interface Material Component 1U Reference Heatsink Description Supplier PN 1U Aluminum Fujikura Fin, Copper Base HSA-8078 Rev A p/n E32409-001 Supplier Contact Info Fujikura America Yuji Yasuda [email protected] 408-988-7478 Note: ATCA Reference heatsink ATCA Copper Fin, Fujikura Copper Base HSA-7901-B p/n E65918-001 Thermal Interface Material Phase Change Honeywell PCM45F Fujikura Taiwan Branch Yao-Hsien Huang [email protected] 886(2)8788-4959 Fujikura America Yuji Yasuda [email protected] 408-748-6991 Fujikura Taiwan Branch Yao-Hsien Huang [email protected] 886(2)8788-4959 Scott Miller 509-252-2206 [email protected] Paula Knoll 858-279-2956 [email protected] Performance targets for heatsinks are described in Section 7.1. Mechanical drawings are provided in Appendix B. Mechanical models are listed in Table 1-1. Heatsinks assemble to server back plate (Table A-2). August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 70