Intel X3350 Design Guide - Page 36

Thermal Specifications 6 Thermal Specifications 6.1 6.1.1 Package Thermal Specifications The Intel® Xeon® processor C5500/C3500 series requires a thermal solution to maintain temperatures within its operating limits. Any attempt to operate the processor outside these operating limits may result in permanent damage to the processor and potentially other components within the system. Maintaining the proper thermal environment is key to reliable, long-term system operation. A complete solution includes both component and system level thermal management features. Component level thermal solutions can include active or passive heatsinks attached to the processor integrated heat spreader (IHS). This section provides data necessary for developing a complete thermal solution. For more information on designing a component level thermal solution, see Section 7. Thermal Specifications To allow the optimal operation and long-term reliability of Intel processor-based systems, the processor must remain within the minimum and maximum case temperature (TCASE) specifications as defined by the applicable thermal profile. Thermal solutions not designed to provide this level of thermal capability may affect the long-term reliability of the processor and system. These specifications are based on pre-silicon estimates. These specifications may be further updated as more data becomes available. Processors are listed here by TDP (Multiple SKUs may have the same TDP and same spec). The Intel® Xeon® processor C5500/C3500 series implements a methodology for managing processor temperatures that is intended to support acoustic noise reduction through fan speed control and to assure processor reliability. Selection of the appropriate fan speed is based on the relative temperature data reported by the processor's Platform Environment Control Interface (PECI) as described in Section 6.3. If PECI is less than TCONTROL, then the case temperature is permitted to exceed the Thermal Profile, but PECI must remain at or below TCONTROL. If PECI >= TCONTROL, then the case temperature must meet the Thermal Profile. The temperature reported over PECI is always a negative value and represents a delta below the onset of thermal control circuit (TCC) activation, as indicated by PROCHOT# (see Section 6.2, Processor Thermal Features). Systems that implement fan speed control must be designed to use this data. Systems that do not alter the fan speed only need to guarantee the case temperature meets the thermal profile specifications. The Intel® Xeon® processor EC5500 and EC3500 series (85 W and 65 W) supports a single Thermal Profile. See specifications below. For this processor, it is expected that the Thermal Control Circuit (TCC) would only be activated for very brief periods of time when running the most power-intensive applications. The Intel® Celeron® processor P1053 (30 W) (see specifications below) supports a single Thermal Profile. For this processor, it is expected that the Thermal Control Circuit (TCC) would only be activated for very brief periods of time when running the most power-intensive applications. August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 36