Intel X3350 Design Guide - Page 10

Introduction Table 1-2. Terms and Descriptions (Sheet 2 of 2) Term TCC TCONTROL TDP Thermal Monitor Thermal Profile TIM TLA TSA U Description Thermal Control Circuit: Thermal monitor uses the TCC to reduce the die temperature by using clock modulation and/or operating frequency and input voltage adjustment when the die temperature is very near its operating limits. Tcontrol is a static value below TCC activation used as a trigger point for fan speed control. Thermal Design Power: Thermal solution must be designed to dissipate this target power level. TDP is not the maximum power that the processor can dissipate. A power reduction feature designed to decrease temperature after the processor has reached its maximum operating temperature. Line that defines case temperature specification of a processor at a given power level. Thermal Interface Material: The thermally conductive compound between the heatsink and the processor case. This material fills the air gaps and voids, and enhances the transfer of the heat from the processor case to the heatsink. The measured ambient temperature locally surrounding the processor. The ambient temperature should be measured just upstream of a passive heatsink or at the fan inlet for an active heatsink. The system ambient air temperature external to a system chassis. This temperature is usually measured at the chassis air inlets. A unit of measure used to define server rack spacing height. 1U is equal to 1.75 in, 2U equals 3.50 in, etc. § August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 10