Intel X3350 Design Guide - Page 37

Thermal Specifications The Intel® Xeon® processor LC5500 and LC3500 series (60 W, 48 W, 35 W, and 23 W) all support Thermal Profiles with nominal and short-term conditions designed to meet NEBS Level 3 compliance. See specifications below. For these SKUs, operation at either the nominal or short-term thermal profiles should result in virtually no TCC activation. Analysis indicates that real applications are unlikely to cause the processor to consume maximum power dissipation for sustained time periods. Intel recommends that complete thermal solution designs target the Thermal Design Power (TDP), instead of the maximum processor power consumption. The Adaptive Thermal Monitor feature is intended to help protect the processor in the event that an application exceeds the TDP recommendation for a sustained time period. For more details on this feature, see Section 6.2. The Adaptive Thermal Monitor feature must be enabled for the processor to remain within its specifications. Table 6-1. Intel® Xeon® Processor EC5549 and EC5509 Thermal Specifications Core Frequency Launch to FMB Thermal Design Power (W) 85 Minimum TCASE (°C) 5 Maximum TCASE (°C) See Figure 6-1; Table 6-2 Notes 1, 2, 3, 4, 5 Figure 6-1. Notes: 1. These values the processor aisrensopt etcoifbieedsautbjVeCcCt_eMdAtXo for all processor frequencies. Systems must any static VCC and ICC combination wherein be designed VCC exceeds to ensure VCC_MAX at specified ICC. See the loadline specifications in the Datasheet. 2. Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the maximum power that the processor can dissipate. TDP is measured at maximum TCASE. 3. These specifications are based on initial silicon characterization. These specifications may be further updated as more characterization data becomes available. 4. Power specifications are defined at all VIDs found in the Datasheet. The Intel® Xeon® processor C5500/ C3500 series may be shipped under multiple VIDs for each frequency. 5. FMB (Flexible Motherboard) guidelines provide a design target for meeting all planned processor frequency requirements. Intel® Xeon® Processor EC5549 and EC5509 Thermal Profile Thermal Profile 80 70 Tcase [C] 60 Thermal Profile Tc = 0.303* P + 51.8 50 40 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 Power [W] Notes: 1. Intel® Xeon® processor EC5549 and EC5509 Thermal Profile is representative of a volumetrically unconstrained platform. See Table 6-2 for discrete points that constitute the thermal profile. 2. Implementation of Intel® Xeon® processor EC5549 and EC5509 Thermal Profile should result in virtually no TCC activation. Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 37 August 2010 Order Number: 323107-002US