Intel X3350 Design Guide - Page 11

Package Mechanical Specifications 2 Package Mechanical Specifications 2.1 Package Mechanical Specifications The processor is packaged in a Flip-Chip Land Grid Array (FC-LGA6) package that interfaces with the motherboard via an LGA1366 socket. The package consists of a processor mounted on a substrate land-carrier. An integrated heat spreader (IHS) is attached to the package substrate and core and serves as the mating surface for processor component thermal solutions, such as a heatsink. Figure 2-1 shows a sketch of the processor package components and how they are assembled together. See Section 3 and Section 4. The package components shown in Figure 2-1 include the following: • Integrated Heat Spreader (IHS) • Thermal Interface Material (TIM) • Processor core (die) • Package substrate • Capacitors Figure 2-1. Processor Package Assembly Sketch IHS Die Substrate System Board TIM Capacitors LGA1366 Socket Note: 1. Socket and motherboard are included for reference and are not part of processor package. August 2010 Order Number: 323107-002US Intel® Xeon® Processor C5500/C3500 Series and LGA1366 Socket Thermal/Mechanical Design Guide 11