HP 14-g000 Maintenance and Service Guide - Page 101

Discrete graphics, UMA graphics, Thermal paste is used on the processor

Get HP 14-g000 PDF manuals and user guides View all HP 14-g000 manuals
Add to My Manuals
Save this manual to your list of manuals

Page 101 highlights

The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board components each time the heat sink is removed. Replacement thermal material is included with the heat sink, processor, and system board spare part kits. The following illustrations show replacement thermal material locations. ● Discrete graphics: Thermal paste is used on the processor and associated heat sink area (1)(2), as well as the graphics chip and associated heat sink area (3)(4). ● UMA graphics: Thermal paste is used on the processor (1) and the heat sink (2). Reverse this procedure to reassemble and install the heat sink assembly. Component replacement procedures 93

  • 1
  • 2
  • 3
  • 4
  • 5
  • 6
  • 7
  • 8
  • 9
  • 10
  • 11
  • 12
  • 13
  • 14
  • 15
  • 16
  • 17
  • 18
  • 19
  • 20
  • 21
  • 22
  • 23
  • 24
  • 25
  • 26
  • 27
  • 28
  • 29
  • 30
  • 31
  • 32
  • 33
  • 34
  • 35
  • 36
  • 37
  • 38
  • 39
  • 40
  • 41
  • 42
  • 43
  • 44
  • 45
  • 46
  • 47
  • 48
  • 49
  • 50
  • 51
  • 52
  • 53
  • 54
  • 55
  • 56
  • 57
  • 58
  • 59
  • 60
  • 61
  • 62
  • 63
  • 64
  • 65
  • 66
  • 67
  • 68
  • 69
  • 70
  • 71
  • 72
  • 73
  • 74
  • 75
  • 76
  • 77
  • 78
  • 79
  • 80
  • 81
  • 82
  • 83
  • 84
  • 85
  • 86
  • 87
  • 88
  • 89
  • 90
  • 91
  • 92
  • 93
  • 94
  • 95
  • 96
  • 97
  • 98
  • 99
  • 100
  • 101
  • 102
  • 103
  • 104
  • 105
  • 106
  • 107
  • 108
  • 109
  • 110
  • 111
  • 112
  • 113
  • 114
  • 115
  • 116
  • 117
  • 118
  • 119
  • 120
  • 121
  • 122
  • 123
  • 124
  • 125
  • 126
  • 127
  • 128
  • 129
  • 130
  • 131
  • 132
  • 133
  • 134
  • 135
  • 136
  • 137
  • 138
  • 139
  • 140
  • 141
  • 142
  • 143
  • 144
  • 145
  • 146
  • 147
  • 148
The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board
components each time the heat sink is removed. Replacement thermal material is included with the heat
sink, processor, and system board spare part kits.
The following illustrations show replacement thermal material locations.
●
Discrete graphics:
Thermal paste is used on the processor and associated heat sink area
(1)(2)
, as well
as the graphics chip and associated heat sink area
(3)(4)
.
●
UMA graphics:
Thermal paste is used on the processor
(1)
and the heat sink
(2)
.
Reverse this procedure to reassemble and install the heat sink assembly.
Component replacement procedures
93