HP 14t-r000 HP 14 Notebook PC Compaq 14 Notebook PC HP 240 G3 Notebook PC HP 2 - Page 98

Discrete graphics, UMA graphics

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The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board components each time the heat sink is removed. Replacement thermal material is included with the heat sink, processor, and system board spare part kits. The following illustrations show replacement thermal material locations. ● Discrete graphics: Thermal paste is used on the processor and associated heat sink area (1)(2), as well as the graphics chip and associated heat sink area (3)(4). ● UMA graphics: Thermal paste is used on the processor (1) and the heat sink (2). Reverse this procedure to reassemble and install the heat sink assembly. 90 Chapter 4 Removal and replacement procedures

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The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board
components each time the heat sink is removed. Replacement thermal material is included with the heat
sink, processor, and system board spare part kits.
The following illustrations show replacement thermal material locations.
●
Discrete graphics:
Thermal paste is used on the processor and associated heat sink area
(1)(2)
, as well
as the graphics chip and associated heat sink area
(3)(4)
.
●
UMA graphics:
Thermal paste is used on the processor
(1)
and the heat sink
(2)
.
Reverse this procedure to reassemble and install the heat sink assembly.
90
Chapter 4
Removal and replacement procedures