HP Designjet L25500 HP Designjet L25500 Printer Series - User's guide (first e - Page 38

The various settings mentioned above are described below., Handle the substrate - latex ink printer

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Substrate family Paper-Solvent HP Photorealistic Drying temp. 50 50 Curing temp. Heating Autoairflow tracking 80 30 Yes 100 30 Yes Cutter Yes Yes Substrate -advance adjust. Input tension 0 15 0 15 Vacuum level 15 30 The various settings mentioned above are described below. Setting Description If too low If too high Drying temp. Curing temp. Heating airflow Auto-tracking The heat applied in the printing zone removes water and fixes the image to the substrate. Print-quality defects such as banding, bleeding and coalescence may occur. Thermal marks may be seen on the substrate; they may appear as vertical bands in some colors. The substrate may wrinkle on the platen, causing vertical banding, ink smears or substrate jams. Curing is needed to coalesce the latex, creating a polymeric film which acts as a protective layer, while at the same time removing the remaining co-solvents from the print. Curing is vital to ensure the durability of the printed images. The print may emerge not fully polymerized, so that the ink smears when rubbed with a finger. The print may appear wet, after printing or later. The substrate may wrinkle under the curing module, causing defects such as bubbles or liner detachment. The substrate wrinkles may also cause vertical banding or ink smears at the beginning of the following plot. Airflow helps to remove the evaporated water from the print zone and thus allows more efficient drying. Print-quality defects such as banding, bleeding and coalescence may occur. The printer may not reach the expected temperature in the print zone, causing defects such as banding, bleeding and coalescence. Poor text and line quality may be seen. The substrate-advance sensor (also known as OMAS) is located under the print platen; it can track the substrate advance automatically. Disable the sensor in the following cases: ● The substrate is porous and allows ink to pass through to the platen. Clean the sensor after using this substrate. ● You are instructed to do so by the front panel, because the sensor is dirty or unable to track this particular substrate. Cutter Substrate-advance adjust. The printer's built-in cutter can cut the substrate automatically between each print. Disable the cutter in the following cases: ● You want to use the take-up reel. ● You want to cut the substrate manually. ● The leading edge of the substrate tends to curl and cause substrate jams. Your printer was calibrated at the factory to ensure that it advances the substrate accurately when using supported substrates in normal environmental conditions. However, you may find it useful to adjust the substrate advance when printing on unsupported substrates or in unusual but stable environmental conditions. Dark lines appear when you use up to six passes. Graininess appears when you use eight or more passes. White lines appear when you use up to six passes. Graininess appears when you use eight or more passes. Handle the substrate 34 Chapter 4 Handle the substrate ENWW

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Substrate family
Drying
temp.
Curing
temp.
Heating
airflow
Auto-
tracking
Cutter
Substrate
-advance
adjust.
Input
tension
Vacuum
level
Paper-Solvent
50
80
30
Yes
Yes
0
15
15
HP Photorealistic
50
100
30
Yes
Yes
0
15
30
The various settings mentioned above are described below.
Setting
Description
If too low
If too high
Drying temp.
The heat applied in the printing
zone removes water and fixes
the image to the substrate.
Print-quality defects such as
banding, bleeding and
coalescence may occur.
Thermal marks may be seen on
the substrate; they may appear
as vertical bands in some colors.
The substrate may wrinkle on the
platen, causing vertical banding,
ink smears or substrate jams.
Curing temp.
Curing is needed to coalesce the
latex, creating a polymeric film
which acts as a protective layer,
while at the same time removing
the remaining co-solvents from
the print. Curing is vital to ensure
the durability of the printed
images.
The print may emerge not fully
polymerized, so that the ink
smears when rubbed with a
finger. The print may appear wet,
after printing or later.
The substrate may wrinkle under
the curing module, causing
defects such as bubbles or liner
detachment. The substrate
wrinkles may also cause vertical
banding or ink smears at the
beginning of the following plot.
Heating airflow
Airflow helps to remove the
evaporated water from the print
zone and thus allows more
efficient drying.
Print-quality defects such as
banding, bleeding and
coalescence may occur.
The printer may not reach the
expected temperature in the print
zone, causing defects such as
banding, bleeding and
coalescence. Poor text and line
quality may be seen.
Auto-tracking
The substrate-advance sensor
(also known as OMAS) is located
under the print platen; it can track
the substrate advance
automatically.
Disable the sensor in the following cases:
The substrate is porous and allows ink to pass through to the
platen. Clean the sensor after using this substrate.
You are instructed to do so by the front panel, because the
sensor is dirty or unable to track this particular substrate.
Cutter
The printer's built-in cutter can
cut the substrate automatically
between each print.
Disable the cutter in the following cases:
You want to use the take-up reel.
You want to cut the substrate manually.
The leading edge of the substrate tends to curl and cause
substrate jams.
Substrate-advance
adjust.
Your printer was calibrated at the
factory to ensure that it advances
the substrate accurately when
using supported substrates in
normal environmental
conditions. However, you may
find it useful to adjust the
substrate advance when printing
on unsupported substrates or in
unusual but stable
environmental conditions.
Dark lines appear when you use
up to six passes. Graininess
appears when you use eight or
more passes.
White lines appear when you use
up to six passes. Graininess
appears when you use eight or
more passes.
34
Chapter 4
Handle the substrate
ENWW
Handle the substrate