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HP ENVY m6-n012dx HP ENVY m6 Notebook PC Maintenance and Service Guide - Page 74

with the heat sink, processor

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3. Remove the heat sink (2). NOTE: Due to the adhesive quality of the thermal material located between the heat sink and the system board components, it may be necessary to move the heat sink from side to side to detach it. NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board components each time the heat sink is removed. Replacement thermal material is included with the heat sink, processor, and system board spare part kits. Thermal paste is used on the processor (1) and the heat sink section (2) that services it. 66 Chapter 6 Removal and replacement procedures for Authorized Service Provider parts

Section	Page
Product description	9
External component identification	16
Finding your hardware and software information	16
Locating hardware	16
Locating software	16
Display	17
Buttons and speakers	18
Keys	19
Lights	20
TouchPad	21
Left side	22
Right side	24
Bottom	25
Illustrated parts catalog	26
Service tag	26
Computer major components	27
Display assembly subcomponents	31
Mass storage devices	33
Miscellaneous parts	34
Sequential part number listing	34
Removal and replacement procedures preliminary requirements	39
Tools required	39
Service considerations	39
Plastic parts	39
Cables and connectors	40
Drive handling	40
Grounding guidelines	41
Electrostatic discharge damage	41
Packaging and transporting guidelines	42
Workstation guidelines	42
Equipment guidelines	43
Removal and replacement procedures for Customer Self-Repair parts	44
Component replacement procedures	44
Battery	45
WLAN module	46
Hard drive	49
Memory module	51
Removal and replacement procedures for Authorized Service Provider parts	54
Component replacement procedures	54
RTC battery	54
Base enclosure	56
Display assembly	59
Fan	67
System board	68
Heat sink	73
Processor	75
Connector board	77
Power connector cable	79
Subwoofer	80
Speakers	82
TouchPad assembly	84
Power button board	86
Keyboard	87
Using Setup Utility (BIOS) and HP PC Hardware Diagnostics (UEFI)	90
Starting Setup Utility (BIOS)	90
Updating the BIOS	90
Determining the BIOS version	90
Downloading a BIOS update	91
Using HP PC Hardware Diagnostics (UEFI)	92
Downloading HP PC Hardware Diagnostics (UEFI) to a USB device	92
Specifications	93
Computer specifications	93
Backing up, restoring, and recovering	94
Creating recovery media and backups	94
Creating HP Recovery media	95
Restore and recovery	96
Recovering using HP Recovery Manager	96
What you need to know	97
Using the HP Recovery partition (select models only)	97
Using HP Recovery media to recover	98
Changing the computer boot order	98
Removing the HP Recovery partition	98
Power cord set requirements	99
Requirements for all countries	99
Requirements for specific countries and regions	100
Recycling	101

Match case Limit results 1 per page

Remove the heat sink

(2)

NOTE:

Due to the adhesive quality of the thermal material located between the heat sink and

the system board components, it may be necessary to move the heat sink from side to side to

detach it.

NOTE:

The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the

system board components each time the heat sink is removed. Replacement thermal material is included

with the heat sink, processor, and system board spare part kits. Thermal paste is used on the processor

(1)

and the heat sink section

(2)

that services it.

Chapter 6

Removal and replacement procedures for Authorized Service Provider parts