HP Pavilion 15-cc600 Maintenance and Service Guide 1 - Page 66

On computer models equipped with a graphics subsystem with discrete memory, that services it.

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NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board components each time the heat sink is removed. Replacement thermal material is included with the heat sink and system board spare part kits. On computer models equipped with a graphics subsystem with discrete memory: Thermal paste is used on the processor (1) and the heat sink section (2) that services it. Thermal paste is also used on the VGA component (3) and the heat sink section (4) that services it. On computer models equipped with a graphics subsystem with UMA memory: Thermal paste is used on the processor (1) and the heat sink section (2) that services it. Reverse this procedure to install the heat sink. 58 Chapter 5 Removal and replacement procedures

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NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system
board components each time the heat sink is removed. Replacement thermal material is included with
the heat sink and system board spare part kits.
On computer models equipped with a graphics subsystem with discrete memory:
Thermal paste is used on
the processor
(1)
and the heat sink section
(2)
that services it. Thermal paste is also used on the VGA
component
(3)
and the heat sink section
(4)
that services it.
On computer models equipped with a graphics subsystem with UMA memory:
Thermal paste is used on
the processor
(1)
and the heat sink section
(2)
that services it.
Reverse this procedure to install the heat sink.
58
Chapter 5
Removal and replacement procedures