HP Pavilion dv6-1200 HP Pavilion dv6 Entertainment PC - Maintenance and Servic - Page 103

and capacitors and their contacts

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10. Remove the fan/heat sink assembly (7). NOTE: Due to the adhesive quality of the thermal material located between the fan/heat sink assembly and system board components, it may be necessary to move the fan/heat sink assembly from side to side to detach the assembly. NOTE: The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink assembly and the system board each time the fan/heat sink assembly is removed. Thermal paste is applied to the fan/heat sink assembly to correspond with components on the system board as follows: capacitors and their contacts (1) the processor and contact (2), the graphics subsystem chip and contact (3), and capacitors and their contacts (4) and (5). Replacement thermal material is included with all fan/heat sink assembly, system board, and processor spare part kits. Reverse this procedure to install the fan/heat sink assembly. Component replacement procedures 95

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10.
Remove the fan/heat sink assembly
(7)
.
NOTE:
Due to the adhesive quality of the thermal material located between the fan/heat sink
assembly and system board components, it may be necessary to move the fan/heat sink assembly
from side to side to detach the assembly.
NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink
assembly and the system board each time the fan/heat sink assembly is removed. Thermal paste
is applied to the fan/heat sink assembly to correspond with components on the system board as
follows: capacitors and their contacts
(1)
the processor and contact
(2)
, the graphics subsystem
chip and contact
(3)
, and capacitors and their contacts
(4)
and
(5)
. Replacement thermal material
is included with all fan/heat sink assembly, system board, and processor spare part kits.
Reverse this procedure to install the fan/heat sink assembly.
Component replacement procedures
95