Intel DQ965CO DQ965CO Technical Product Specification - Page 73

Thermal Considerations

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Technical Reference 2.11 Thermal Considerations CAUTION This board requires the use of a BTX Type I or Type II Thermal Module for the processor. Failure to ensure appropriate airflow may result in reduced performance of both the processor and/or voltage regulator or, in some instances, damage to the board. For a list of chassis that have been tested with Intel desktop boards please refer to the following website: http://developer.intel.com/design/motherbd/cooling.htm All responsibility for determining the adequacy of any thermal or system design remains solely with the reader. Intel makes no warranties or representations that merely following the instructions presented in this document will result in a system with adequate thermal performance. CAUTION Ensure that the ambient temperature does not exceed the board's maximum operating temperature. Failure to do so could cause components to exceed their maximum case temperature and malfunction. For information about the maximum operating temperature, see the environmental specifications in Section 2.13. CAUTION Ensure that proper airflow is maintained in the processor voltage regulator circuit. Failure to do so may result in damage to the voltage regulator circuit. The processor voltage regulator area (shown in Figure 24) can reach a temperature of up to 85 oC in an open chassis. 73

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Technical Reference
73
2.11
Thermal Considerations
CAUTION
This board requires the use of a BTX Type I or Type II Thermal Module for the
processor.
Failure to ensure appropriate airflow may result in reduced performance of both the
processor and/or voltage regulator or, in some instances, damage to the board.
For a
list of chassis that have been tested with Intel desktop boards please refer to the
following website:
All responsibility for determining the adequacy of any thermal or system design
remains solely with the reader.
Intel makes no warranties or representations that
merely following the instructions presented in this document will result in a system
with adequate thermal performance.
CAUTION
Ensure that the ambient temperature does not exceed the board’s maximum operating
temperature.
Failure to do so could cause components to exceed their maximum case
temperature and malfunction.
For information about the maximum operating
temperature, see the environmental specifications in Section 2.13.
CAUTION
Ensure that proper airflow is maintained in the processor voltage regulator circuit.
Failure to do so may result in damage to the voltage regulator circuit.
The processor
voltage regulator area (shown in Figure 24) can reach a temperature of up to 85
o
C in
an open chassis.