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Intel DQ965CO DQ965CO Technical Product Specification - Page 76

Environmental

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Intel Desktop Board DQ965CO Technical Product Specification 2.13 Environmental Table 37 lists the environmental specifications for the board. Table 37. Desktop Board DQ965CO Environmental Specifications Parameter Specification Temperature Non-Operating Operating -40 °C to +70 °C 0 °C to +55 °C Shock Unpackaged 50 g trapezoidal waveform Velocity change of 170 inches/second² Packaged Half sine 2 millisecond Product weight (pounds) Free fall (inches) Velocity change (inches/sec²)

Section	Page
Intel® Desktop Board DQ965CO Technical Product Specification	1
Revision History / Disclaimer	2
Preface	3
Intended Audience	3
What This Document Contains	3
Typographical Conventions	3
Contents	5
1 Product Description	11
1.1 Overview	12
1.1.1 Feature Summary	12
1.1.2 Manufacturing Options	13
1.1.3 Board Layout	14
1.1.4 Block Diagram	16
1.2 Online Support	17
1.3 Processor	17
1.4 System Memory	18
1.4.1 Memory Configurations	20
1.5 Intel® Virtualization Technology (Intel® VT)	25
1.6 Intel® vPro™ Technology Support	26
1.7 Intel® Q965 Express Chipset	27
1.7.1 Intel Q965 Graphics Subsystem	27
1.7.2 USB	30
1.7.3 Serial ATA Interfaces	30
1.7.4 Parallel IDE Interface	31
1.7.5 Real-Time Clock, CMOS SRAM, and Battery	32
1.8 Legacy I/O Controller	32
1.8.1 Serial Port Interface	32
1.8.2 Parallel Port Interface	33
1.8.3 Diskette Drive Interface	33
1.8.4 PS/2 Keyboard and Mouse Interface (Optional)	33
1.9 Audio Subsystem	34
1.9.1 Audio Subsystem Software	34
1.9.2 Audio Connectors and Headers	35
1.10 LAN Subsystem	36
1.10.1 Intel® 82566DM Gigabit Ethernet Controller	36
1.10.2 LAN Subsystem Software	36
1.10.3 RJ-45 LAN Connector with Integrated LEDs	37
1.10.4 Intel® Active Management Technology (Intel® AMT) with System Defense Feature	37
1.10.5 Alert Standard Format (ASF) 2.0 Support	38
1.11 Hardware Management Subsystem	39
1.11.1 Hardware Monitoring and Fan Control	39
1.11.2 Fan Monitoring	39
1.11.3 Chassis Intrusion and Detection	39
1.11.4 Thermal Monitoring	40
1.12 Power Management	41
1.12.1 ACPI	41
1.12.2 Hardware Support	43
1.13 Trusted Platform Module (TPM)	48
2 Technical Reference	49
2.1 Memory Map	49
2.1.1 Addressable Memory	49
2.2 DMA Channels	51
2.3 Fixed I/O Map	52
2.4 PCI Configuration Space Map	53
2.5 Interrupts	54
2.6 PCI Interrupt Routing Map	55
2.7 Connectors and Headers	56
2.7.1 Back Panel Connectors	57
2.7.2 Component-side Connectors and Headers	58
2.8 Jumper Block	67
2.9 Mechanical Considerations	68
2.9.1 Form Factor	68
2.9.2 I/O Shield	69
2.10 Electrical Considerations	71
2.10.1 DC Loading	71
2.10.2 Fan Header Current Capability	71
2.10.3 Add-in Board Considerations	72
2.10.4 Power Supply Considerations	72
2.11 Thermal Considerations	73
2.12 Reliability	75
2.13 Environmental	76
3 Overview of BIOS Features	77
3.1 Introduction	77
3.2 BIOS Flash Memory Organization	78
3.3 Resource Configuration	78
3.3.1 PCI Autoconfiguration	78
3.3.2 PCI IDE Support	79
3.4 System Management BIOS (SMBIOS)	79
3.5 Legacy USB Support	80
3.6 BIOS Updates	80
3.6.1 Language Support	81
3.6.2 Custom Splash Screen	81
3.7 BIOS Recovery	81
3.8 Boot Options	82
3.8.1 CD-ROM Boot	82
3.8.2 Network Boot	82
3.8.3 Booting Without Attached Devices	82
3.8.4 Changing the Default Boot Device During POST	82
3.9 Adjusting Boot Speed	83
3.9.1 Peripheral Selection and Configuration	83
3.9.2 BIOS Boot Optimizations	83
3.10 BIOS Security Features	84
4 Error Messages and Beep Codes	85
4.1 Speaker	85
4.2 BIOS Beep Codes	85
4.3 BIOS Error Messages	85
4.4 Port 80h POST Codes	86
5 Regulatory Compliance and Battery Disposal Information	91
5.1 Regulatory Compliance	91
5.1.1 Safety Regulations	91
5.1.2 European Union Declaration of Conformity Statement	92
5.1.3 Product Ecology Statements	94
5.1.4 EMC Regulations	97
5.1.5 Product Certification Markings (Board Level)	98